Part Details for IS62WV2568BLL-55BLI by Integrated Silicon Solution Inc
Overview of IS62WV2568BLL-55BLI by Integrated Silicon Solution Inc
- Distributor Offerings: (7 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for IS62WV2568BLL-55BLI
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
43M5463
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Newark | 2Mb, Low Power/Power Saver, async,256K X 8,55Ns,2.5V-3.6V,36 Ball Mbga (6X8 Mm), Rohs |Integrated Silicon Solution (Issi) IS62WV2568BLL-55BLI Min Qty: 480 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$1.7300 / $1.7900 | Buy Now |
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DISTI #
IS62WV2568BLL-55BLI-ND
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DigiKey | IC SRAM 2MBIT PARALLEL 36TFBGA Min Qty: 480 Lead time: 10 Weeks Container: Tray | Temporarily Out of Stock |
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$2.2206 | Buy Now |
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DISTI #
IS62WV2568BLL-55BL
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Avnet Americas | SRAM Chip Async Single 3.3V 2M-Bit 256K x 8 55ns 36-Pin Mini-BGA - Bulk (Alt: IS62WV2568BLL-55BL) RoHS: Compliant Min Qty: 480 Package Multiple: 480 Container: Bulk | 0 |
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$1.6250 / $1.9890 | Buy Now |
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DISTI #
87062WV2568BLL55BLI
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Mouser Electronics | SRAM 2Mb 256Kx8 55ns Async SRAM RoHS: Compliant | 0 |
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$2.7500 / $4.0100 | Order Now |
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DISTI #
IS62WV2568BLL-55BL
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Avnet Americas | SRAM Chip Async Single 3.3V 2M-Bit 256K x 8 55ns 36-Pin Mini-BGA - Bulk (Alt: IS62WV2568BLL-55BL) RoHS: Compliant Min Qty: 480 Package Multiple: 480 Container: Bulk | 0 |
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$1.6250 / $1.9890 | Buy Now |
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DISTI #
IS62WV2568BLL-55BLI
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Avnet Silica | SRAM Chip Async Single 3.3V 2M-Bit 256K x 8 55ns 36-Pin Mini-BGA (Alt: IS62WV2568BLL-55BLI) RoHS: Compliant Min Qty: 480 Package Multiple: 480 Lead time: 2 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
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Chip1Cloud | IC SRAM 2MBIT PARALLEL 36TFBGA | 9700 |
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RFQ |
Part Details for IS62WV2568BLL-55BLI
IS62WV2568BLL-55BLI CAD Models
IS62WV2568BLL-55BLI Part Data Attributes:
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IS62WV2568BLL-55BLI
Integrated Silicon Solution Inc
Buy Now
Datasheet
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Compare Parts:
IS62WV2568BLL-55BLI
Integrated Silicon Solution Inc
Standard SRAM, 256KX8, 55ns, CMOS, PBGA36, 6 X 8 MM, LEAD FREE, MINI, BGA-36
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Part Package Code | BGA | |
| Package Description | TFBGA, BGA36,6X8,30 | |
| Pin Count | 36 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Samacsys Manufacturer | Integrated Silicon Solution Inc. | |
| Access Time-Max | 55 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B36 | |
| JESD-609 Code | e1 | |
| Length | 8 mm | |
| Memory Density | 2097152 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 36 | |
| Number of Words | 262144 words | |
| Number of Words Code | 256000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA36,6X8,30 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Standby Current-Max | 0.00001 A | |
| Standby Voltage-Min | 1 V | |
| Supply Current-Max | 0.035 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.5 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN SILVER COPPER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.75 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 10 | |
| Width | 6 mm |