Part Details for IS62LV5128LL-70B by Integrated Silicon Solution Inc
Results Overview of IS62LV5128LL-70B by Integrated Silicon Solution Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
IS62LV5128LL-70B Information
IS62LV5128LL-70B by Integrated Silicon Solution Inc is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Part Details for IS62LV5128LL-70B
IS62LV5128LL-70B CAD Models
IS62LV5128LL-70B Part Data Attributes
|
IS62LV5128LL-70B
Integrated Silicon Solution Inc
Buy Now
Datasheet
|
Compare Parts:
IS62LV5128LL-70B
Integrated Silicon Solution Inc
Standard SRAM, 512KX8, 70ns, CMOS, PBGA36, 8 X 10 MM, MINI, BGA-36
Select a part to compare: |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
Part Package Code | BGA | |
Package Description | 8 X 10 MM, MINI, BGA-36 | |
Pin Count | 36 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Access Time-Max | 70 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-PBGA-B36 | |
JESD-609 Code | e0 | |
Length | 10 mm | |
Memory Density | 4194304 bit | |
Memory IC Type | STANDARD SRAM | |
Memory Width | 8 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 36 | |
Number of Words | 524288 words | |
Number of Words Code | 512000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 512KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA36,6X8,30 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.35 mm | |
Standby Current-Max | 4e-7 A | |
Standby Voltage-Min | 2 V | |
Supply Current-Max | 0.045 mA | |
Supply Voltage-Max (Vsup) | 3.15 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 0.75 mm | |
Terminal Position | BOTTOM | |
Width | 8 mm |