Datasheets
IS62LV5128LL-70B by: Integrated Silicon Solution Inc

Standard SRAM, 512KX8, 70ns, CMOS, PBGA36, 8 X 10 MM, MINI, BGA-36

Part Details for IS62LV5128LL-70B by Integrated Silicon Solution Inc

Results Overview of IS62LV5128LL-70B by Integrated Silicon Solution Inc

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

IS62LV5128LL-70B Information

IS62LV5128LL-70B by Integrated Silicon Solution Inc is an SRAM.
SRAMs are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Part Details for IS62LV5128LL-70B

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IS62LV5128LL-70B Part Data Attributes

IS62LV5128LL-70B Integrated Silicon Solution Inc
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IS62LV5128LL-70B Integrated Silicon Solution Inc Standard SRAM, 512KX8, 70ns, CMOS, PBGA36, 8 X 10 MM, MINI, BGA-36
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Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC
Part Package Code BGA
Package Description 8 X 10 MM, MINI, BGA-36
Pin Count 36
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 70 ns
I/O Type COMMON
JESD-30 Code R-PBGA-B36
JESD-609 Code e0
Length 10 mm
Memory Density 4194304 bit
Memory IC Type STANDARD SRAM
Memory Width 8
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 36
Number of Words 524288 words
Number of Words Code 512000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 512KX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA36,6X8,30
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 1.35 mm
Standby Current-Max 4e-7 A
Standby Voltage-Min 2 V
Supply Current-Max 0.045 mA
Supply Voltage-Max (Vsup) 3.15 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 0.75 mm
Terminal Position BOTTOM
Width 8 mm