Part Details for IS62LV1024LL-70T by Integrated Silicon Solution Inc
Results Overview of IS62LV1024LL-70T by Integrated Silicon Solution Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
IS62LV1024LL-70T Information
IS62LV1024LL-70T by Integrated Silicon Solution Inc is an SRAM.
SRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Price & Stock for IS62LV1024LL-70T
| Part # | Distributor | Description | Stock | Price | Buy | |
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Quest Components | IC,SRAM,128KX8,CMOS,TSSOP,32PIN,PLASTIC | 61 |
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$2.4750 / $4.9500 | Buy Now |
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NexGen Digital | 1251 |
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RFQ |
Part Details for IS62LV1024LL-70T
IS62LV1024LL-70T CAD Models
IS62LV1024LL-70T Part Data Attributes
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IS62LV1024LL-70T
Integrated Silicon Solution Inc
Buy Now
Datasheet
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Compare Parts:
IS62LV1024LL-70T
Integrated Silicon Solution Inc
Standard SRAM, 128KX8, 70ns, CMOS, PDSO32, TSOP1-32
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Part Package Code | TSOP1 | |
| Package Description | TSOP1-32 | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 70 ns | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PDSO-G32 | |
| JESD-609 Code | e0 | |
| Length | 18.4 mm | |
| Memory Density | 1048576 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 128KX8 | |
| Output Characteristics | 3-STATE | |
| Output Enable | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSOP1 | |
| Package Equivalence Code | TSSOP32,.8,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.2 mm | |
| Standby Current-Max | 0.000025 A | |
| Standby Voltage-Min | 2 V | |
| Supply Current-Max | 0.04 mA | |
| Supply Voltage-Max (Vsup) | 3.3 V | |
| Supply Voltage-Min (Vsup) | 2.5 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL | |
| Width | 8 mm |
IS62LV1024LL-70T Frequently Asked Questions (FAQ)
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The recommended PCB layout for the IS62LV1024LL-70T involves placing the device near the microcontroller or processor, using short and direct traces for the address and data lines, and providing adequate decoupling capacitors to minimize noise and power supply fluctuations.
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It is recommended to power up the SRAM after the microcontroller or processor, and power down the SRAM before the microcontroller or processor. This ensures that the SRAM is properly initialized and avoids any potential data corruption or loss.
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The maximum operating frequency for the IS62LV1024LL-70T is 70MHz, as indicated in the part number. However, the actual operating frequency may be limited by the system design, signal integrity, and other factors.
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Yes, the IS62LV1024LL-70T is a 3.3V device and can be used in a 3.3V system. However, it is essential to ensure that the voltage supply is within the recommended operating range of 3.0V to 3.6V to maintain data integrity and prevent damage to the device.
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The IS62LV1024LL-70T is a volatile SRAM, which means that it will lose its data when power is removed. To handle data retention during power-down, it is recommended to use a battery-backed SRAM or a non-volatile memory device, such as a flash memory or an EEPROM.