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Overview of IS61NVP51236-250B2I by Integrated Silicon Solution Inc
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- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Computing and Data Storage
Renewable Energy
Robotics and Drones
CAD Models for IS61NVP51236-250B2I by Integrated Silicon Solution Inc
Part Data Attributes for IS61NVP51236-250B2I by Integrated Silicon Solution Inc
|
|
---|---|
Pbfree Code
|
No
|
Rohs Code
|
No
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
INTEGRATED SILICON SOLUTION INC
|
Part Package Code
|
BGA
|
Package Description
|
BGA,
|
Pin Count
|
119
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
3A991.B.2.A
|
HTS Code
|
8542.32.00.41
|
Access Time-Max
|
2.6 ns
|
Additional Feature
|
PIPELINED ARCHITECTURE
|
JESD-30 Code
|
R-PBGA-B119
|
JESD-609 Code
|
e0
|
Memory Density
|
18874368 bit
|
Memory IC Type
|
ZBT SRAM
|
Memory Width
|
36
|
Moisture Sensitivity Level
|
3
|
Number of Functions
|
1
|
Number of Terminals
|
119
|
Number of Words
|
524288 words
|
Number of Words Code
|
512000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
512KX36
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
BGA
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY
|
Parallel/Serial
|
PARALLEL
|
Qualification Status
|
Not Qualified
|
Supply Voltage-Max (Vsup)
|
2.625 V
|
Supply Voltage-Min (Vsup)
|
2.375 V
|
Supply Voltage-Nom (Vsup)
|
2.5 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Finish
|
TIN LEAD
|
Terminal Form
|
BALL
|
Terminal Position
|
BOTTOM
|