Datasheets
IS61NLP102418B-200B3LI by: Integrated Silicon Solution Inc

Standard SRAM, 1MX18, 3ns, CMOS, PBGA165, 13 X 15 MM, LEAD FREE, TFBGA-165

Part Details for IS61NLP102418B-200B3LI by Integrated Silicon Solution Inc

Results Overview of IS61NLP102418B-200B3LI by Integrated Silicon Solution Inc

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Applications Consumer Electronics Internet of Things (IoT) Computing and Data Storage

IS61NLP102418B-200B3LI Information

IS61NLP102418B-200B3LI by Integrated Silicon Solution Inc is an SRAM.
SRAMs are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Price & Stock for IS61NLP102418B-200B3LI

Part # Distributor Description Stock Price Buy
DISTI # 706-1388-ND
DigiKey IC SRAM 18MBIT PARALLEL 165TFBGA Min Qty: 1 Lead time: 10 Weeks Container: Tray 23
In Stock
  • 1 $19.3300
  • 10 $17.9060
  • 25 $17.3404
  • 40 $17.0523
  • 144 $16.2769
  • 288 $15.8658
  • 576 $15.4623
$15.4623 / $19.3300 Buy Now
DISTI # IS61NLP102418B-200B3LI
Avnet Americas SRAM Chip Sync Dual 3.3V 18M-Bit 1M x 18 3ns 165-Pin TFBGA - Bulk (Alt: IS61NLP102418B-200B3LI) RoHS: Not Compliant Min Qty: 144 Package Multiple: 144 Lead time: 10 Weeks, 0 Days Container: Bulk 0
  • 144 $13.9356
  • 288 $13.8645
  • 576 $13.7934
  • 864 $13.7223
  • 1,152 $13.2480
$13.2480 / $13.9356 Buy Now
DISTI # 870-61NLP102B200B3LI
Mouser Electronics SRAM 18Mb,"No-Wait"/Pipeline,Sync,1Mb x 18,200Mhz,3.3v/2.5v - I/O,165 Ball BGA, RoHS RoHS: Compliant 0
  • 144 $16.0000
  • 288 $15.7500
$15.7500 / $16.0000 Order Now
DISTI # IS61NLP102418B-200B3LI
Avnet Silica SRAM Chip Sync Dual 33V 18MBit 1M x 18 3ns 165Pin TFBGA (Alt: IS61NLP102418B-200B3LI) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Lead time: 14 Weeks, 0 Days Silica - 0
Buy Now
DISTI # IS61NLP102418B-200B3LI
EBV Elektronik SRAM Chip Sync Dual 33V 18MBit 1M x 18 3ns 165Pin TFBGA (Alt: IS61NLP102418B-200B3LI) RoHS: Compliant Min Qty: 144 Package Multiple: 144 Lead time: 13 Weeks, 0 Days EBV - 0
Buy Now

Part Details for IS61NLP102418B-200B3LI

IS61NLP102418B-200B3LI CAD Models

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IS61NLP102418B-200B3LI Part Data Attributes

IS61NLP102418B-200B3LI Integrated Silicon Solution Inc
Buy Now Datasheet
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IS61NLP102418B-200B3LI Integrated Silicon Solution Inc Standard SRAM, 1MX18, 3ns, CMOS, PBGA165, 13 X 15 MM, LEAD FREE, TFBGA-165
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Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC
Package Description TBGA,
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Factory Lead Time 10 Weeks
Samacsys Manufacturer Integrated Silicon Solution Inc.
Access Time-Max 3 ns
JESD-30 Code R-PBGA-B165
Length 15 mm
Memory Density 18874368 bit
Memory IC Type STANDARD SRAM
Memory Width 18
Number of Functions 1
Number of Terminals 165
Number of Words 1048576 words
Number of Words Code 1000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 1MX18
Package Body Material PLASTIC/EPOXY
Package Code TBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1.2 mm
Supply Voltage-Max (Vsup) 3.465 V
Supply Voltage-Min (Vsup) 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 13 mm

Alternate Parts for IS61NLP102418B-200B3LI

This table gives cross-reference parts and alternative options found for IS61NLP102418B-200B3LI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IS61NLP102418B-200B3LI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
IS61NLP102418-200B3LI Integrated Silicon Solution Inc Check for Price ZBT SRAM, 1MX18, 3.1ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, LEAD FREE, PLASTIC, TFBGA-165 IS61NLP102418B-200B3LI vs IS61NLP102418-200B3LI
Part Number Manufacturer Composite Price Description Compare
IS61NLP102418B-200B3L Integrated Silicon Solution Inc Check for Price Standard SRAM, 1MX18, 3ns, CMOS, PBGA165, 13 X 15 MM, LEAD FREE, TFBGA-165 IS61NLP102418B-200B3LI vs IS61NLP102418B-200B3L

IS61NLP102418B-200B3LI Related Parts

IS61NLP102418B-200B3LI Frequently Asked Questions (FAQ)

  • The recommended PCB layout for optimal performance can be found in the IS61NLP102418B-200B3LI application note or by contacting ISSI's technical support team. They can provide guidance on layout considerations, such as signal routing, decoupling, and power supply bypassing.

  • The IS61NLP102418B-200B3LI has a maximum junction temperature of 150°C. To handle thermal management, ensure good airflow around the device, use a heat sink if necessary, and follow the thermal design guidelines provided in the datasheet or application note.

  • The recommended power-up sequence for the IS61NLP102418B-200B3LI is to power up the VCC supply before the VCCQ supply. This ensures that the internal voltage regulators are properly initialized. Refer to the datasheet or application note for more details.

  • To troubleshoot issues with the IS61NLP102418B-200B3LI, start by reviewing the datasheet and application note to ensure that the device is being used within its recommended operating conditions. Then, use a logic analyzer or oscilloscope to capture and analyze the device's signals. If the issue persists, contact ISSI's technical support team for further assistance.

  • Yes, the IS61NLP102418B-200B3LI is a sensitive device and requires proper ESD handling precautions. Handle the device by the body or use an ESD wrist strap, and ensure that the workspace and equipment are ESD-safe. Refer to the datasheet or application note for more information on ESD handling.