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Part Details for IS61NLP102418B-200B3L-TR by Integrated Silicon Solution Inc
Overview of IS61NLP102418B-200B3L-TR by Integrated Silicon Solution Inc
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for IS61NLP102418B-200B3L-TR
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
52Y2357
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Newark | 18Mb,"no-Wait"/Pipeline, sync,1Mb X 18,200Mhz,3.3V/2.5V - I/O,165 Ball Bga, Rohs |Integrated Silicon Solution (Issi) IS61NLP102418B-200B3L-TR RoHS: Not Compliant Min Qty: 2000 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
|
$11.7900 | Buy Now |
|
DISTI #
IS61NLP102418B-200B3L-TR-ND
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DigiKey | IC SRAM 18MBIT PARALLEL 165TFBGA Min Qty: 2000 Lead time: 10 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$12.8222 | Buy Now |
|
DISTI #
IS61NLP102418B-200
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Avnet Americas | SRAM Chip Sync Dual 3.3V 18M-Bit 1M x 18 165-Pin TFBGA T/R - Tape and Reel (Alt: IS61NLP102418B-200) RoHS: Not Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 12 Weeks, 0 Days Container: Reel | 0 |
|
$11.3355 | Buy Now |
|
DISTI #
870-61NLP108B200B3LT
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Mouser Electronics | SRAM 18Mb,"No-Wait"/Pipeline,Sync,1Mb x 18,200Mhz,33v/25v - I/O,165 Ball BGA, RoHS RoHS: Compliant | 0 |
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$12.7200 | Order Now |
Part Details for IS61NLP102418B-200B3L-TR
IS61NLP102418B-200B3L-TR CAD Models
IS61NLP102418B-200B3L-TR Part Data Attributes
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IS61NLP102418B-200B3L-TR
Integrated Silicon Solution Inc
Buy Now
Datasheet
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IS61NLP102418B-200B3L-TR
Integrated Silicon Solution Inc
IC SRAM 18MBIT 200MHZ 165BGA
|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Package Description | TBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Factory Lead Time | 12 Weeks | |
| Samacsys Manufacturer | Integrated Silicon Solution Inc. | |
| Access Time-Max | 3 ns | |
| JESD-30 Code | R-PBGA-B165 | |
| Length | 15 mm | |
| Memory Density | 18874368 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 18 | |
| Number of Functions | 1 | |
| Number of Terminals | 165 | |
| Number of Words | 1048576 words | |
| Number of Words Code | 1000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 1MX18 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max (Vsup) | 3.465 V | |
| Supply Voltage-Min (Vsup) | 3.135 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 13 mm |