Datasheets
IS61NLP102418-200B3LI by: Integrated Silicon Solution Inc

ZBT SRAM, 1MX18, 3.1ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, LEAD FREE, PLASTIC, TFBGA-165

Part Details for IS61NLP102418-200B3LI by Integrated Silicon Solution Inc

Overview of IS61NLP102418-200B3LI by Integrated Silicon Solution Inc

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Applications Consumer Electronics Internet of Things (IoT) Computing and Data Storage

Price & Stock for IS61NLP102418-200B3LI

Part # Distributor Description Stock Price Buy
DISTI # 95M6338
Newark 18Mb,"no-Wait"/Pipeline, sync,1Mb X 18,200Mhz,3.3V/2.5V - I/O,165 Ball Bga, Rohs |Integrated Silicon Solution (Issi) IS61NLP102418-200B3LI Min Qty: 144 Package Multiple: 1 Date Code: 0 Container: Bulk 0
  • 100 $17.8500
  • 250 $17.3400
$17.3400 / $17.8500 Buy Now
DISTI # IS61NLP102418-200B
Avnet Americas SRAM Chip Sync Dual 3.3V 18M-Bit 1M x 18 3.1ns 165-Pin BGA - Bulk (Alt: IS61NLP102418-200B) RoHS: Not Compliant Min Qty: 144 Package Multiple: 144 Lead time: 12 Weeks, 0 Days Container: Bulk 0
  • 144 $19.5075
  • 288 $18.9975
  • 576 $18.1050
  • 864 $17.5950
  • 1,152 $16.9575
  • 1,440 $16.4475
  • 14,400 $15.9375
$15.9375 / $19.5075 Buy Now
DISTI # 870-61NLP1024182B3LI
Mouser Electronics SRAM 18Mb,"No-Wait"/Pipeline,Sync,1Mb x 18,200Mhz,3.3v/2.5v - I/O,165 Ball BGA, RoHS RoHS: Compliant 0
  • 144 $18.2100
  • 288 $17.8700
$17.8700 / $18.2100 Order Now

Part Details for IS61NLP102418-200B3LI

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IS61NLP102418-200B3LI Part Data Attributes

IS61NLP102418-200B3LI Integrated Silicon Solution Inc
Buy Now Datasheet
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IS61NLP102418-200B3LI Integrated Silicon Solution Inc ZBT SRAM, 1MX18, 3.1ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, LEAD FREE, PLASTIC, TFBGA-165
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC
Part Package Code BGA
Package Description TBGA, BGA165,11X15,40
Pin Count 165
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Factory Lead Time 12 Weeks
Samacsys Manufacturer Integrated Silicon Solution Inc.
Access Time-Max 3.1 ns
Additional Feature PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 200 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B165
JESD-609 Code e1
Length 15 mm
Memory Density 18874368 bit
Memory IC Type ZBT SRAM
Memory Width 18
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 165
Number of Words 1048576 words
Number of Words Code 1000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 1MX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Standby Current-Max 0.075 A
Standby Voltage-Min 3.14 V
Supply Current-Max 0.475 mA
Supply Voltage-Max (Vsup) 3.465 V
Supply Voltage-Min (Vsup) 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 10
Width 13 mm

Alternate Parts for IS61NLP102418-200B3LI

This table gives cross-reference parts and alternative options found for IS61NLP102418-200B3LI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IS61NLP102418-200B3LI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
IS61NLP102418B-200B3LI Standard SRAM, 1MX18, 3ns, CMOS, PBGA165, 13 X 15 MM, LEAD FREE, TFBGA-165 Integrated Silicon Solution Inc IS61NLP102418-200B3LI vs IS61NLP102418B-200B3LI
IS61NLP102418-200B3I ZBT SRAM, 1MX18, 3.1ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, PLASTIC, TFBGA-165 Integrated Silicon Solution Inc IS61NLP102418-200B3LI vs IS61NLP102418-200B3I
IS61NLP102418B-200B3 Standard SRAM, 1MX18, 3ns, CMOS, PBGA165, 13 X 15 MM, TFBGA-165 Integrated Silicon Solution Inc IS61NLP102418-200B3LI vs IS61NLP102418B-200B3
IS61NLP102418-200B3 ZBT SRAM, 1MX18, 3.1ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, PLASTIC, TFBGA-165 Integrated Silicon Solution Inc IS61NLP102418-200B3LI vs IS61NLP102418-200B3
IS61NLP102418B-200B3I Standard SRAM, 1MX18, 3ns, CMOS, PBGA165, 13 X 15 MM, TFBGA-165 Integrated Silicon Solution Inc IS61NLP102418-200B3LI vs IS61NLP102418B-200B3I
Part Number Description Manufacturer Compare
IS61NLP102418B-200B3L Standard SRAM, 1MX18, 3ns, CMOS, PBGA165, 13 X 15 MM, LEAD FREE, TFBGA-165 Integrated Silicon Solution Inc IS61NLP102418-200B3LI vs IS61NLP102418B-200B3L
IS61NLP102418B-200B3LI Standard SRAM, 1MX18, 3ns, CMOS, PBGA165, 13 X 15 MM, LEAD FREE, TFBGA-165 Integrated Silicon Solution Inc IS61NLP102418-200B3LI vs IS61NLP102418B-200B3LI
IS61NLP102418-200B3I ZBT SRAM, 1MX18, 3.1ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, PLASTIC, TFBGA-165 Integrated Silicon Solution Inc IS61NLP102418-200B3LI vs IS61NLP102418-200B3I
IS61NLP102418-200B3 ZBT SRAM, 1MX18, 3.1ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, PLASTIC, TFBGA-165 Integrated Silicon Solution Inc IS61NLP102418-200B3LI vs IS61NLP102418-200B3
IS61NLP102418B-200B3 Standard SRAM, 1MX18, 3ns, CMOS, PBGA165, 13 X 15 MM, TFBGA-165 Integrated Silicon Solution Inc IS61NLP102418-200B3LI vs IS61NLP102418B-200B3

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