Part Details for IS61LPD25636A-200TQLI by Integrated Silicon Solution Inc
Overview of IS61LPD25636A-200TQLI by Integrated Silicon Solution Inc
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for IS61LPD25636A-200TQLI
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
58M0517
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Newark | 8Mb, pipeline, sync,256K X 36,200Mhz,3.3V I/O,100 Pin Tqfp,3Ce, Rohs |Integrated Silicon Solution (Issi) IS61LPD25636A-200TQLI RoHS: Not Compliant Min Qty: 72 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$11.5600 / $14.4500 | Buy Now |
DISTI #
IS61LPD25636A-200TQLI-ND
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DigiKey | IC SRAM 9MBIT PARALLEL 100TQFP Min Qty: 72 Lead time: 10 Weeks Container: Tray | Temporarily Out of Stock |
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$14.5901 | Buy Now |
DISTI #
IS61LPD25636A-200T
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Avnet Americas | SRAM Chip Sync Single 3.3V 9M-Bit 256K x 36 3.1ns 100-Pin TQFP - Bulk (Alt: IS61LPD25636A-200T) RoHS: Not Compliant Min Qty: 72 Package Multiple: 72 Lead time: 10 Weeks, 0 Days Container: Bulk | 0 |
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$9.7325 / $12.0700 | Buy Now |
DISTI #
870-61LPD25636A2TQLI
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Mouser Electronics | SRAM 8Mb,Pipeline,Sync,256K x 36,200Mhz,3.3v I/O,100 Pin TQFP,3CE, RoHS RoHS: Compliant | 0 |
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$12.5500 / $13.3300 | Order Now |
Part Details for IS61LPD25636A-200TQLI
IS61LPD25636A-200TQLI CAD Models
IS61LPD25636A-200TQLI Part Data Attributes
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IS61LPD25636A-200TQLI
Integrated Silicon Solution Inc
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Datasheet
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IS61LPD25636A-200TQLI
Integrated Silicon Solution Inc
Cache SRAM, 256KX36, 3.1ns, CMOS, PQFP100, TQFP-100
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
Part Package Code | QFP | |
Package Description | LQFP, QFP100,.63X.87 | |
Pin Count | 100 | |
Reach Compliance Code | compliant | |
ECCN Code | 3A991.B.2.A | |
HTS Code | 8542.32.00.41 | |
Factory Lead Time | 10 Weeks | |
Access Time-Max | 3.1 ns | |
Additional Feature | PIPELINED ARCHITECTURE | |
Clock Frequency-Max (fCLK) | 200 MHz | |
I/O Type | COMMON | |
JESD-30 Code | R-PQFP-G100 | |
JESD-609 Code | e3 | |
Length | 20 mm | |
Memory Density | 9437184 bit | |
Memory IC Type | CACHE SRAM | |
Memory Width | 36 | |
Number of Functions | 1 | |
Number of Terminals | 100 | |
Number of Words | 262144 words | |
Number of Words Code | 256000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 256KX36 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | LQFP | |
Package Equivalence Code | QFP100,.63X.87 | |
Package Shape | RECTANGULAR | |
Package Style | FLATPACK, LOW PROFILE | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.6 mm | |
Standby Current-Max | 0.06 A | |
Standby Voltage-Min | 3.14 V | |
Supply Current-Max | 0.275 mA | |
Supply Voltage-Max (Vsup) | 3.465 V | |
Supply Voltage-Min (Vsup) | 3.135 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | MATTE TIN | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | QUAD | |
Time@Peak Reflow Temperature-Max (s) | 10 | |
Width | 14 mm |