Datasheets
IS61DDB22M36A-300M3L by: Integrated Silicon Solution Inc

DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165

Part Details for IS61DDB22M36A-300M3L by Integrated Silicon Solution Inc

Overview of IS61DDB22M36A-300M3L by Integrated Silicon Solution Inc

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Price & Stock for IS61DDB22M36A-300M3L

Part # Distributor Description Stock Price Buy
DISTI # IS61DDB22M36A-300M
Avnet Americas SRAM Chip Sync Single 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin LFBGA - Bulk (Alt: IS61DDB22M36A-300M) RoHS: Compliant Min Qty: 105 Package Multiple: 105 Lead time: 30 Weeks, 0 Days Container: Bulk 0
RFQ
DISTI # IS61DDB22M36A-300M
Avnet Americas SRAM Chip Sync Single 1.8V 72M-Bit 2M x 36 0.45ns 165-Pin LFBGA - Bulk (Alt: IS61DDB22M36A-300M) RoHS: Compliant Min Qty: 105 Package Multiple: 105 Lead time: 30 Weeks, 0 Days Container: Bulk 0
RFQ
DISTI # 870-61B22M36A300M3L
Mouser Electronics SRAM 72Mb 300Mhz 2Mx36 DDR-II Sync SRAM RoHS: Compliant 0
  • 105 $68.3200
$68.3200 Order Now

Part Details for IS61DDB22M36A-300M3L

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IS61DDB22M36A-300M3L Part Data Attributes

IS61DDB22M36A-300M3L Integrated Silicon Solution Inc
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IS61DDB22M36A-300M3L Integrated Silicon Solution Inc DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165
Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC
Part Package Code BGA
Package Description LBGA,
Pin Count 165
Reach Compliance Code compliant
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Factory Lead Time 30 Weeks
Access Time-Max 0.45 ns
Additional Feature PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B165
Length 17 mm
Memory Density 75497472 bit
Memory IC Type DDR SRAM
Memory Width 36
Number of Functions 1
Number of Terminals 165
Number of Words 2097152 words
Number of Words Code 2000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 2MX36
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 1.4 mm
Supply Voltage-Max (Vsup) 1.89 V
Supply Voltage-Min (Vsup) 1.71 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15 mm

Alternate Parts for IS61DDB22M36A-300M3L

This table gives cross-reference parts and alternative options found for IS61DDB22M36A-300M3L. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IS61DDB22M36A-300M3L, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
GS8662Q37BD-200 DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology IS61DDB22M36A-300M3L vs GS8662Q37BD-200
IS61DDPB42M36A-550B4 DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LFBGA-165 Integrated Silicon Solution Inc IS61DDB22M36A-300M3L vs IS61DDPB42M36A-550B4
GS8662D37BGD-400IT DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165 GSI Technology IS61DDB22M36A-300M3L vs GS8662D37BGD-400IT
IS61DDP2B22M36A-550M3 DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LFBGA-165 Integrated Silicon Solution Inc IS61DDB22M36A-300M3L vs IS61DDP2B22M36A-550M3
IS61DDPB42M36A-400M3LI DDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 Integrated Silicon Solution Inc IS61DDB22M36A-300M3L vs IS61DDPB42M36A-400M3LI
IS61QDP2B22M36A-300M3LI QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LEAD FREE, LFBGA-165 Integrated Silicon Solution Inc IS61DDB22M36A-300M3L vs IS61QDP2B22M36A-300M3LI
GS8662S36BGD-350T Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, BGA-165 GSI Technology IS61DDB22M36A-300M3L vs GS8662S36BGD-350T
IS61QDPB22M36A-300M3I QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1.40 MM HEIGHT, LFBGA-165 Integrated Silicon Solution Inc IS61DDB22M36A-300M3L vs IS61QDPB22M36A-300M3I
GS8662S36BGD-333I Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, ROHS COMPLIANT, MO-216CAB-1, FPBGA-165 GSI Technology IS61DDB22M36A-300M3L vs GS8662S36BGD-333I
GS8662DT37BD-333 QDR SRAM, 2MX36, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165 GSI Technology IS61DDB22M36A-300M3L vs GS8662DT37BD-333

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