Part Details for IS49NLC93200-25WBLI by Integrated Silicon Solution Inc
Overview of IS49NLC93200-25WBLI by Integrated Silicon Solution Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for IS49NLC93200-25WBLI
Part # | Distributor | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
DISTI #
37AC0681
|
Newark | Rldram2 Memory, 288Mbit, X9, Common I/O, 400Mhz, Rohs, Ind. Temp, Wbga |Integrated Silicon Solution (Issi) IS49NLC93200-25WBLI Min Qty: 104 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$24.5800 / $25.4000 | Buy Now |
DISTI #
870-49NLC9320025WBLI
|
Mouser Electronics | DRAM RLDRAM2 Memory, 288Mbit, x9, Common I/O, 400MHz, RoHS, Ind. Temp, wBGA RoHS: Compliant | 0 |
|
$25.5400 / $26.2500 | Order Now |
Part Details for IS49NLC93200-25WBLI
IS49NLC93200-25WBLI CAD Models
IS49NLC93200-25WBLI Part Data Attributes
|
IS49NLC93200-25WBLI
Integrated Silicon Solution Inc
Buy Now
Datasheet
|
Compare Parts:
IS49NLC93200-25WBLI
Integrated Silicon Solution Inc
DDR DRAM, 32MX9, CMOS, PBGA144, WBGA-144
|
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
Package Description | TBGA, | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.28 | |
Samacsys Manufacturer | Integrated Silicon Solution Inc. | |
Access Mode | MULTI BANK PAGE BURST | |
Clock Frequency-Max (fCLK) | 400 MHz | |
I/O Type | COMMON | |
JESD-30 Code | R-PBGA-B144 | |
Length | 18.5 mm | |
Memory Density | 301989888 bit | |
Memory IC Type | DDR1 DRAM | |
Memory Width | 9 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 144 | |
Number of Words | 33554432 words | |
Number of Words Code | 32000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 32MX9 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA144,12X18,40/32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Refresh Cycles | 8192 | |
Seated Height-Max | 1.2 mm | |
Self Refresh | YES | |
Sequential Burst Length | 2,4,8 | |
Standby Current-Max | 0.048 A | |
Supply Current-Max | 0.97 mA | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 11 mm |