Datasheets
IS46LR16320C-6BLA2 by: Integrated Silicon Solution Inc

DDR DRAM, 32MX16, 5.5ns, CMOS, PBGA60, 8 X 10 MM, LEAD FREE, MO-207, TFBGA-60

Part Details for IS46LR16320C-6BLA2 by Integrated Silicon Solution Inc

Results Overview of IS46LR16320C-6BLA2 by Integrated Silicon Solution Inc

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IS46LR16320C-6BLA2 Information

IS46LR16320C-6BLA2 by Integrated Silicon Solution Inc is a DRAM.
DRAMs are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Price & Stock for IS46LR16320C-6BLA2

Part # Distributor Description Stock Price Buy
DISTI # IS46LR16320C-6BLA2-ND
DigiKey IC DRAM 512MBIT PAR 60TFBGA Min Qty: 300 Lead time: 10 Weeks Container: Tray Temporarily Out of Stock
  • 300 $12.3390
$12.3390 Buy Now
DISTI # IS46LR16320C-6BLA2
Avnet Americas DRAM Chip Mobile-DDR SDRAM 512M-Bit 32Mx16 1.8V 60-Pin TFBGA - Bulk (Alt: IS46LR16320C-6BLA2) RoHS: Not Compliant Min Qty: 300 Package Multiple: 300 Lead time: 10 Weeks, 0 Days Container: Bulk 0
  • 300 $11.2112
  • 600 $11.1540
  • 1,200 $10.8805
  • 1,800 $10.8244
  • 2,400 $10.7683
$10.7683 / $11.2112 Buy Now
DISTI # 870-I46LR16320C6BLA2
Mouser Electronics DRAM Automotive (-40 to +105C), 512M, 1.8V, Mobile DDR, 32Mx16, 60 ball BGA (8mmx10mm) RoHS RoHS: Compliant 0
  • 300 $12.3400
  • 600 $12.1600
$12.1600 / $12.3400 Order Now
DISTI # IS46LR16320C-6BLA2
Avnet Silica (Alt: IS46LR16320C-6BLA2) RoHS: Compliant Min Qty: 300 Package Multiple: 300 Lead time: 14 Weeks, 0 Days Silica - 0
Buy Now
DISTI # IS46LR16320C-6BLA2
EBV Elektronik (Alt: IS46LR16320C-6BLA2) RoHS: Compliant Min Qty: 300 Package Multiple: 300 Lead time: 9 Weeks, 0 Days EBV - 0
Buy Now

Part Details for IS46LR16320C-6BLA2

IS46LR16320C-6BLA2 CAD Models

IS46LR16320C-6BLA2 Part Data Attributes

IS46LR16320C-6BLA2 Integrated Silicon Solution Inc
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IS46LR16320C-6BLA2 Integrated Silicon Solution Inc DDR DRAM, 32MX16, 5.5ns, CMOS, PBGA60, 8 X 10 MM, LEAD FREE, MO-207, TFBGA-60
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Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC
Package Description TFBGA-60
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.28
Factory Lead Time 10 Weeks
Samacsys Manufacturer Integrated Silicon Solution Inc.
Access Mode FOUR BANK PAGE BURST
Access Time-Max 5.5 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 167 MHz
I/O Type COMMON
Interleaved Burst Length 2,4,8,16
JESD-30 Code R-PBGA-B60
Length 10 mm
Memory Density 536870912 bit
Memory IC Type DDR1 DRAM
Memory Width 16
Number of Functions 1
Number of Ports 1
Number of Terminals 60
Number of Words 33554432 words
Number of Words Code 32000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 105 °C
Operating Temperature-Min -40 °C
Organization 32MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA60,9X10,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified
Refresh Cycles 8192
Screening Level AEC-Q100
Seated Height-Max 1.1 mm
Self Refresh YES
Sequential Burst Length 2,4,8,16
Standby Current-Max 0.0003 A
Supply Current-Max 0.11 mA
Supply Voltage-Max (Vsup) 1.95 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Width 8 mm

IS46LR16320C-6BLA2 Related Parts

IS46LR16320C-6BLA2 Frequently Asked Questions (FAQ)

  • The maximum operating temperature range for the IS46LR16320C-6BLA2 is -40°C to 85°C.

  • The power-up sequence for the IS46LR16320C-6BLA2 should follow the recommended sequence in the datasheet, which is VCC, then VIO, and finally CLK. This ensures proper initialization and operation of the device.

  • The recommended PCB layout and routing for the IS46LR16320C-6BLA2 involves keeping the signal traces short and away from power and ground planes, using a solid ground plane, and avoiding vias under the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.

  • To troubleshoot issues with the IS46LR16320C-6BLA2, start by checking the power supply and clock signals, then verify the device is properly configured and initialized. Use a logic analyzer or oscilloscope to capture and analyze the signals, and consult the datasheet and application notes for guidance.

  • The IS46LR16320C-6BLA2 has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB to dissipate heat. Ensure good thermal conductivity between the device and the PCB, and consider using thermal vias or a heat sink if necessary.