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DDR DRAM, 32MX16, 5.5ns, CMOS, PBGA60, 8 X 10 MM, LEAD FREE, MO-207, TFBGA-60
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
IS46LR16320C-6BLA2 by Integrated Silicon Solution Inc is a DRAM.
DRAMs are under the broader part category of Memory Components.
Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
IS46LR16320C-6BLA2-ND
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DigiKey | IC DRAM 512MBIT PAR 60TFBGA Min Qty: 300 Lead time: 10 Weeks Container: Tray | Temporarily Out of Stock |
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$12.3390 | Buy Now |
DISTI #
IS46LR16320C-6BLA2
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Avnet Americas | DRAM Chip Mobile-DDR SDRAM 512M-Bit 32Mx16 1.8V 60-Pin TFBGA - Bulk (Alt: IS46LR16320C-6BLA2) RoHS: Not Compliant Min Qty: 300 Package Multiple: 300 Lead time: 10 Weeks, 0 Days Container: Bulk | 0 |
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$10.7683 / $11.2112 | Buy Now |
DISTI #
870-I46LR16320C6BLA2
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Mouser Electronics | DRAM Automotive (-40 to +105C), 512M, 1.8V, Mobile DDR, 32Mx16, 60 ball BGA (8mmx10mm) RoHS RoHS: Compliant | 0 |
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$12.1600 / $12.3400 | Order Now |
DISTI #
IS46LR16320C-6BLA2
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Avnet Silica | (Alt: IS46LR16320C-6BLA2) RoHS: Compliant Min Qty: 300 Package Multiple: 300 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Buy Now | |
DISTI #
IS46LR16320C-6BLA2
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EBV Elektronik | (Alt: IS46LR16320C-6BLA2) RoHS: Compliant Min Qty: 300 Package Multiple: 300 Lead time: 9 Weeks, 0 Days | EBV - 0 |
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Buy Now |
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IS46LR16320C-6BLA2
Integrated Silicon Solution Inc
Buy Now
Datasheet
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Compare Parts:
IS46LR16320C-6BLA2
Integrated Silicon Solution Inc
DDR DRAM, 32MX16, 5.5ns, CMOS, PBGA60, 8 X 10 MM, LEAD FREE, MO-207, TFBGA-60
Select a part to compare: |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
Package Description | TFBGA-60 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.28 | |
Factory Lead Time | 10 Weeks | |
Samacsys Manufacturer | Integrated Silicon Solution Inc. | |
Access Mode | FOUR BANK PAGE BURST | |
Access Time-Max | 5.5 ns | |
Additional Feature | AUTO/SELF REFRESH | |
Clock Frequency-Max (fCLK) | 167 MHz | |
I/O Type | COMMON | |
Interleaved Burst Length | 2,4,8,16 | |
JESD-30 Code | R-PBGA-B60 | |
Length | 10 mm | |
Memory Density | 536870912 bit | |
Memory IC Type | DDR1 DRAM | |
Memory Width | 16 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 60 | |
Number of Words | 33554432 words | |
Number of Words Code | 32000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 32MX16 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Equivalence Code | BGA60,9X10,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Qualification Status | Not Qualified | |
Refresh Cycles | 8192 | |
Screening Level | AEC-Q100 | |
Seated Height-Max | 1.1 mm | |
Self Refresh | YES | |
Sequential Burst Length | 2,4,8,16 | |
Standby Current-Max | 0.0003 A | |
Supply Current-Max | 0.11 mA | |
Supply Voltage-Max (Vsup) | 1.95 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Width | 8 mm |