Part Details for IS46DR16640B-3DBLA2 by Integrated Silicon Solution Inc
Overview of IS46DR16640B-3DBLA2 by Integrated Silicon Solution Inc
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for IS46DR16640B-3DBLA2
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
18W6896
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Newark | |Integrated Silicon Solution (Issi) IS46DR16640B-3DBLA2 RoHS: Not Compliant Min Qty: 209 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$8.9400 / $10.5800 | Buy Now |
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DISTI #
IS46DR16640B-3DBLA2-ND
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DigiKey | IC DRAM 1GBIT PARALLEL 84TWBGA Min Qty: 209 Lead time: 10 Weeks Container: Tray | Limited Supply - Call |
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$10.0540 | Buy Now |
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DISTI #
870-46DR16640B3DBLA2
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Mouser Electronics | DRAM 1G (64Mx16) 333MHz 1.8v DDR2 SDRAM RoHS: Compliant | 105 |
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$9.5600 / $12.3100 | Buy Now |
Part Details for IS46DR16640B-3DBLA2
IS46DR16640B-3DBLA2 CAD Models
IS46DR16640B-3DBLA2 Part Data Attributes
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IS46DR16640B-3DBLA2
Integrated Silicon Solution Inc
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Datasheet
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IS46DR16640B-3DBLA2
Integrated Silicon Solution Inc
DDR DRAM, 64MX16, 0.45ns, CMOS, PBGA84, 8 X 12.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, TWBGA-84
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| Rohs Code | Yes | |
| Part Life Cycle Code | Not Recommended | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Package Description | TFBGA, BGA84,9X15,32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.32 | |
| Samacsys Manufacturer | Integrated Silicon Solution Inc. | |
| Access Mode | MULTI BANK PAGE BURST | |
| Access Time-Max | 0.45 ns | |
| Additional Feature | AUTO/SELF REFRESH | |
| Clock Frequency-Max (fCLK) | 333 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 4,8 | |
| JESD-30 Code | R-PBGA-B84 | |
| Length | 12.5 mm | |
| Memory Density | 1073741824 bit | |
| Memory IC Type | DDR2 DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 84 | |
| Number of Words | 67108864 words | |
| Number of Words Code | 64000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 64MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA84,9X15,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 8192 | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 4,8 | |
| Standby Current-Max | 0.015 A | |
| Supply Current-Max | 0.25 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 8 mm |