Part Details for IS43TR82560CL-125KBL by Integrated Silicon Solution Inc
Overview of IS43TR82560CL-125KBL by Integrated Silicon Solution Inc
- Distributor Offerings: (5 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for IS43TR82560CL-125KBL
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
81Y1416
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Newark | 2G, 1.35V, Ddr3L, 256Mx8, 1600Mt/S @ 11-11-11, 78 Ball Bga (8Mm X10.5Mm) Rohs, It |Integrated Silicon Solution (Issi) IS43TR82560CL-125KBL Min Qty: 242 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$3.6800 / $4.3500 | Buy Now |
DISTI #
706-IS43TR82560CL-125KBL-ND
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DigiKey | 2G, 1.35V, DDR3L, 256Mx8, 1600MT Min Qty: 242 Lead time: 8 Weeks Container: Bulk | Temporarily Out of Stock |
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$4.4744 | Buy Now |
DISTI #
IS43TR82560CL-125K
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Avnet Americas | DRAM Chip DDR3L SDRAM 2G-Bit 256M X 8 1.35V 78-Pin TWBGA - Trays (Alt: IS43TR82560CL-125K) RoHS: Not Compliant Min Qty: 242 Package Multiple: 242 Lead time: 8 Weeks, 0 Days Container: Tray | 0 |
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$3.3750 / $4.1310 | Buy Now |
DISTI #
870-43T82560CL125KBL
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Mouser Electronics | DRAM 2G, 1.35V, DDR3L, 256Mx8, 1600MT/s a. 11-11-11, 78 ball BGA (8mm x10.5mm) RoHS, IT RoHS: Compliant | 0 |
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$5.7700 / $6.2800 | Order Now |
DISTI #
IS43TR82560CL-125KBL
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Avnet Silica | DRAM Chip DDR3L SDRAM 2G-Bit 256M X 8 1.35V 78-Pin TWBGA (Alt: IS43TR82560CL-125KBL) RoHS: Compliant Min Qty: 242 Package Multiple: 242 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Buy Now |
Part Details for IS43TR82560CL-125KBL
IS43TR82560CL-125KBL CAD Models
IS43TR82560CL-125KBL Part Data Attributes:
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IS43TR82560CL-125KBL
Integrated Silicon Solution Inc
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Datasheet
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IS43TR82560CL-125KBL
Integrated Silicon Solution Inc
DDR DRAM, 256MX8, CMOS, PBGA78, FBGA-78
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Rohs Code | Yes | |
Part Life Cycle Code | Not Recommended | |
Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
Package Description | TFBGA, | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.36 | |
Factory Lead Time | 8 Weeks | |
Samacsys Manufacturer | Integrated Silicon Solution Inc. | |
Access Mode | MULTI BANK PAGE BURST | |
Additional Feature | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH | |
JESD-30 Code | R-PBGA-B78 | |
JESD-609 Code | e1 | |
Length | 10.5 mm | |
Memory Density | 2147483648 bit | |
Memory IC Type | DDR3L DRAM | |
Memory Width | 8 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 78 | |
Number of Words | 268435456 words | |
Number of Words Code | 256000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | ||
Organization | 256MX8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.2 mm | |
Self Refresh | YES | |
Supply Voltage-Max (Vsup) | 1.45 V | |
Supply Voltage-Min (Vsup) | 1.283 V | |
Supply Voltage-Nom (Vsup) | 1.35 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | OTHER | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 10 | |
Width | 8 mm |