Part Details for IS43TR16256ECL-125LB2LI by Integrated Silicon Solution Inc
Overview of IS43TR16256ECL-125LB2LI by Integrated Silicon Solution Inc
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for IS43TR16256ECL-125LB2LI
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
706-IS43TR16256ECL-125LB2LI-ND
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DigiKey | 4G, 1.35V, DDR3L w/ ECC,256Mx16, Lead time: 8 Weeks Container: Bulk | Temporarily Out of Stock |
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Buy Now | |
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DISTI #
IS43TR16256ECL-125LB2LI
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Avnet Americas | DRAM Chip DDR3 SDRAM 4G-bit 1600MHz 96-Pin BGA - Trays (Alt: IS43TR16256ECL-125LB2LI) RoHS: Compliant Min Qty: 136 Package Multiple: 136 Lead time: 12 Weeks, 0 Days Container: Tray | 0 |
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RFQ | |
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DISTI #
IS43TR16256ECL-125LB2LI
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Avnet Asia | DRAM Chip DDR3 SDRAM 4G-bit 1600MHz 96-Pin BGA (Alt: IS43TR16256ECL-125LB2LI) RoHS: Compliant Min Qty: 136 Package Multiple: 136 Lead time: 14 Weeks, 0 Days | 0 |
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RFQ | |
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DISTI #
IS43TR16256ECL-125LB2LI
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Avnet Silica | DRAM Chip DDR3 SDRAM 4G-bit 1600MHz 96-Pin BGA (Alt: IS43TR16256ECL-125LB2LI) RoHS: Compliant Min Qty: 1 Package Multiple: 1 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Part Details for IS43TR16256ECL-125LB2LI
IS43TR16256ECL-125LB2LI CAD Models
IS43TR16256ECL-125LB2LI Part Data Attributes:
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IS43TR16256ECL-125LB2LI
Integrated Silicon Solution Inc
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Datasheet
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IS43TR16256ECL-125LB2LI
Integrated Silicon Solution Inc
DDR3L DRAM, 256MX16, 15ns, CMOS, PBGA96, BGA-96
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Package Description | BGA-96 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.36 | |
| Factory Lead Time | 12 Weeks | |
| Access Mode | MULTI BANK PAGE BURST | |
| Additional Feature | AUTO/SELF REFRESH | |
| Clock Frequency-Max (fCLK) | 200 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 4,8 | |
| JESD-30 Code | R-PBGA-B96 | |
| Length | 14 mm | |
| Memory Density | 4294967296 bit | |
| Memory IC Type | DDR3 DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 96 | |
| Number of Words | 268435456 words | |
| Number of Words Code | 256000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 95 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA96,9X16,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Refresh Cycles | 8192 | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 4,8 | |
| Standby Current-Max | 0.092 A | |
| Supply Current-Max | 0.254 mA | |
| Supply Voltage-Max (Vsup) | 1.45 V | |
| Supply Voltage-Min (Vsup) | 1.283 V | |
| Supply Voltage-Nom (Vsup) | 1.35 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 10 mm |