Part Details for IS43TR16256BL-125KBL-TR by Integrated Silicon Solution Inc
Overview of IS43TR16256BL-125KBL-TR by Integrated Silicon Solution Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for IS43TR16256BL-125KBL-TR
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
706-IS43TR16256BL-125KBL-TR-ND
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DigiKey | IC DRAM 4GBIT PARALLEL 96TWBGA Min Qty: 1500 Lead time: 8 Weeks Container: Tape & Reel (TR) | Temporarily Out of Stock |
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$5.3992 | Buy Now |
DISTI #
870-43T16256BL125KBT
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Mouser Electronics | DRAM 4G, 1.35V, DDR3L, 256Mx16, 1600MT/s a. 11-11-11, 96 ball BGA (9mm x13mm) RoHS, T&R RoHS: Compliant | 0 |
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$6.7300 | Order Now |
Part Details for IS43TR16256BL-125KBL-TR
IS43TR16256BL-125KBL-TR CAD Models
IS43TR16256BL-125KBL-TR Part Data Attributes:
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IS43TR16256BL-125KBL-TR
Integrated Silicon Solution Inc
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Datasheet
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IS43TR16256BL-125KBL-TR
Integrated Silicon Solution Inc
DDR3L DRAM, 256MX16, CMOS, PBGA96,
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Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
Reach Compliance Code | compliant | |
Factory Lead Time | 8 Weeks | |
Samacsys Manufacturer | Integrated Silicon Solution Inc. | |
Access Mode | MULTI BANK PAGE BURST | |
Additional Feature | AUTO/SELF REFRESH | |
JESD-30 Code | R-PBGA-B96 | |
JESD-609 Code | e1 | |
Length | 13 mm | |
Memory Density | 4294967296 bit | |
Memory IC Type | DDR3L DRAM | |
Memory Width | 16 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Ports | 1 | |
Number of Terminals | 96 | |
Number of Words | 268435456 words | |
Number of Words Code | 256000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 95 °C | |
Operating Temperature-Min | ||
Organization | 256MX16 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 1.2 mm | |
Self Refresh | YES | |
Supply Voltage-Max (Vsup) | 1.45 V | |
Supply Voltage-Min (Vsup) | 1.283 V | |
Supply Voltage-Nom (Vsup) | 1.35 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 9 mm |