Part Details for IS43R32800D-6BL-TR by Integrated Silicon Solution Inc
Overview of IS43R32800D-6BL-TR by Integrated Silicon Solution Inc
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for IS43R32800D-6BL-TR
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
18W6829
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Newark | 256M, 2.5V, Ddr, 8Mx32, 166Mhz, 144-Ball Bga (12Mm X 12Mm) Rohs, T&r |Integrated Silicon Solution (Issi) IS43R32800D-6BL-TR RoHS: Not Compliant Min Qty: 1500 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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$6.8600 | Buy Now |
DISTI #
IS43R32800D-6BL-TR
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Avnet Americas | DRAM Chip DDR SDRAM 256M-Bit 8M x 32 2.5V 144-Pin LFBGA T/R - Tape and Reel (Alt: IS43R32800D-6BL-TR) RoHS: Not Compliant Min Qty: 1500 Package Multiple: 1500 Lead time: 8 Weeks, 0 Days Container: Reel | 0 |
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RFQ | |
DISTI #
870-IS43R32800D6BLTR
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Mouser Electronics | DRAM 256M, 2.5V, DDR, 8Mx32, 166MHz, 144-ball BGA (12mmx12mm) RoHS, T&R RoHS: Compliant | 0 |
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$5.2700 | Order Now |
Part Details for IS43R32800D-6BL-TR
IS43R32800D-6BL-TR CAD Models
IS43R32800D-6BL-TR Part Data Attributes
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IS43R32800D-6BL-TR
Integrated Silicon Solution Inc
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Datasheet
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IS43R32800D-6BL-TR
Integrated Silicon Solution Inc
DDR DRAM, 8MX32, 0.7ns, CMOS, PBGA144,
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Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
Package Description | FBGA, BGA144,12X12,32 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.24 | |
Factory Lead Time | 8 Weeks | |
Samacsys Manufacturer | Integrated Silicon Solution Inc. | |
Access Time-Max | 0.7 ns | |
Clock Frequency-Max (fCLK) | 166 MHz | |
I/O Type | COMMON | |
Interleaved Burst Length | 2,4,8 | |
JESD-30 Code | S-PBGA-B144 | |
Memory Density | 268435456 bit | |
Memory IC Type | DDR1 DRAM | |
Memory Width | 32 | |
Number of Terminals | 144 | |
Number of Words | 8388608 words | |
Number of Words Code | 8000000 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 8MX32 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA144,12X12,32 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, FINE PITCH | |
Qualification Status | Not Qualified | |
Refresh Cycles | 4096 | |
Sequential Burst Length | 2,4,8 | |
Standby Current-Max | 0.005 A | |
Supply Current-Max | 0.405 mA | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM |