Part Details for IS43DR81280B-25DBL-TR by Integrated Silicon Solution Inc
Overview of IS43DR81280B-25DBL-TR by Integrated Silicon Solution Inc
- Distributor Offerings: (4 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for IS43DR81280B-25DBL-TR
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
18W6797
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Newark | 1G, 1.8V, Ddr2, 128Mx8, 400Mhz @cl5, 60 Ball Bga, (8Mm X 10.5Mm), Rohs, T&r |Integrated Silicon Solution (Issi) IS43DR81280B-25DBL-TR RoHS: Not Compliant Min Qty: 2000 Package Multiple: 1 Date Code: 0 Container: Reel | 0 |
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$5.0100 | Buy Now |
DISTI #
IS43DR81280B-25DBL-TR-ND
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DigiKey | IC DRAM 1GBIT PARALLEL 60TWBGA Min Qty: 2000 Lead time: 8 Weeks Container: Tape & Reel (TR) | Limited Supply - Call |
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$5.8600 | Buy Now |
DISTI #
IS43DR81280B-25DBL
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Avnet Americas | DRAM Chip DDR2 SDRAM 1G-Bit 128M x 8 1.8V 60-Pin TWBGA T/R - Tape and Reel (Alt: IS43DR81280B-25DBL) RoHS: Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 10 Weeks, 0 Days Container: Reel | 0 |
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$4.9552 | Buy Now |
DISTI #
870-43DR81280B25DBLT
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Mouser Electronics | DRAM 1G, 18V, DDR2, 128Mx8, 400Mhz a.CL5, 60 ball BGA, (8mmx 105mm), RoHS, T&R RoHS: Compliant | 0 |
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$5.6800 | Order Now |
Part Details for IS43DR81280B-25DBL-TR
IS43DR81280B-25DBL-TR CAD Models
IS43DR81280B-25DBL-TR Part Data Attributes
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IS43DR81280B-25DBL-TR
Integrated Silicon Solution Inc
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Datasheet
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IS43DR81280B-25DBL-TR
Integrated Silicon Solution Inc
DDR DRAM, 128MX8, 0.4ns, CMOS, PBGA60,
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Rohs Code | Yes | |
Part Life Cycle Code | Not Recommended | |
Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
Package Description | FBGA, BGA60,9X11,32 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.32 | |
Factory Lead Time | 10 Weeks | |
Access Time-Max | 0.4 ns | |
Clock Frequency-Max (fCLK) | 400 MHz | |
I/O Type | COMMON | |
Interleaved Burst Length | 4,8 | |
JESD-30 Code | R-PBGA-B60 | |
Memory Density | 1073741824 bit | |
Memory IC Type | DDR2 DRAM | |
Memory Width | 8 | |
Number of Terminals | 60 | |
Number of Words | 134217728 words | |
Number of Words Code | 128000000 | |
Organization | 128MX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | FBGA | |
Package Equivalence Code | BGA60,9X11,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, FINE PITCH | |
Qualification Status | Not Qualified | |
Refresh Cycles | 8192 | |
Sequential Burst Length | 4,8 | |
Supply Current-Max | 0.29 mA | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM |