Datasheets
IS43DR81280B-25DBL-TR by: Integrated Silicon Solution Inc

DDR DRAM, 128MX8, 0.4ns, CMOS, PBGA60,

Part Details for IS43DR81280B-25DBL-TR by Integrated Silicon Solution Inc

Overview of IS43DR81280B-25DBL-TR by Integrated Silicon Solution Inc

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Price & Stock for IS43DR81280B-25DBL-TR

Part # Distributor Description Stock Price Buy
DISTI # 18W6797
Newark 1G, 1.8V, Ddr2, 128Mx8, 400Mhz @cl5, 60 Ball Bga, (8Mm X 10.5Mm), Rohs, T&r |Integrated Silicon Solution (Issi) IS43DR81280B-25DBL-TR RoHS: Not Compliant Min Qty: 2000 Package Multiple: 1 Date Code: 0 Container: Reel 0
  • 1,500 $5.0100
$5.0100 Buy Now
DISTI # IS43DR81280B-25DBL-TR-ND
DigiKey IC DRAM 1GBIT PARALLEL 60TWBGA Min Qty: 2000 Lead time: 8 Weeks Container: Tape & Reel (TR) Limited Supply - Call
  • 2,000 $5.8600
$5.8600 Buy Now
DISTI # IS43DR81280B-25DBL
Avnet Americas DRAM Chip DDR2 SDRAM 1G-Bit 128M x 8 1.8V 60-Pin TWBGA T/R - Tape and Reel (Alt: IS43DR81280B-25DBL) RoHS: Compliant Min Qty: 2000 Package Multiple: 2000 Lead time: 10 Weeks, 0 Days Container: Reel 0
  • 2,000 $4.9552
$4.9552 Buy Now
DISTI # 870-43DR81280B25DBLT
Mouser Electronics DRAM 1G, 18V, DDR2, 128Mx8, 400Mhz a.CL5, 60 ball BGA, (8mmx 105mm), RoHS, T&R RoHS: Compliant 0
  • 2,000 $5.6800
$5.6800 Order Now

Part Details for IS43DR81280B-25DBL-TR

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IS43DR81280B-25DBL-TR Part Data Attributes

IS43DR81280B-25DBL-TR Integrated Silicon Solution Inc
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IS43DR81280B-25DBL-TR Integrated Silicon Solution Inc DDR DRAM, 128MX8, 0.4ns, CMOS, PBGA60,
Rohs Code Yes
Part Life Cycle Code Not Recommended
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC
Package Description FBGA, BGA60,9X11,32
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.32
Factory Lead Time 10 Weeks
Access Time-Max 0.4 ns
Clock Frequency-Max (fCLK) 400 MHz
I/O Type COMMON
Interleaved Burst Length 4,8
JESD-30 Code R-PBGA-B60
Memory Density 1073741824 bit
Memory IC Type DDR2 DRAM
Memory Width 8
Number of Terminals 60
Number of Words 134217728 words
Number of Words Code 128000000
Organization 128MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code FBGA
Package Equivalence Code BGA60,9X11,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, FINE PITCH
Qualification Status Not Qualified
Refresh Cycles 8192
Sequential Burst Length 4,8
Supply Current-Max 0.29 mA
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM

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