Part Details for IS43DR16640B-25DBL by Integrated Silicon Solution Inc
Overview of IS43DR16640B-25DBL by Integrated Silicon Solution Inc
- Distributor Offerings: (9 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Price & Stock for IS43DR16640B-25DBL
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
18W6782
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Newark | 1G, 1.8V, Ddr2, 64Mx16, 400Mhz @ Cl5, 84 Ball Bga (8Mm X 12.5Mm) Rohs |Integrated Silicon Solution (Issi) IS43DR16640B-25DBL Min Qty: 209 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$3.7700 / $4.6600 | Buy Now |
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DISTI #
706-1275-ND
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DigiKey | IC DRAM 1GBIT PARALLEL 84TWBGA Min Qty: 1 Lead time: 6 Weeks Container: Tray | Limited Supply - Call |
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$4.1207 / $5.7800 | Buy Now |
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DISTI #
IS43DR16640B-25DBL
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Avnet Americas | DRAM, DDR2, 1 Gbit, 64M x 16bit, 400 MHz, 84 Pins, TWBGA - Bulk (Alt: IS43DR16640B-25DBL) RoHS: Not Compliant Min Qty: 209 Package Multiple: 209 Lead time: 8 Weeks, 0 Days Container: Bulk | 0 |
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$3.4625 / $4.2381 | Buy Now |
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DISTI #
IS43DR16640B-25DBL
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Avnet Americas | DRAM Chip DDR2 SDRAM 1G-Bit 64Mx16 1.8V 84-Pin TWBGA - Bulk (Alt: IS43DR16640B-25DBL) RoHS: Not Compliant Min Qty: 209 Package Multiple: 209 Lead time: 8 Weeks, 0 Days Container: Bulk | 0 |
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$5.5500 / $6.7932 | Buy Now |
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DISTI #
IS43DR16640B-25DBL
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Avnet Americas | DRAM Chip DDR2 SDRAM 1G-Bit 64M x 16 1.8V 84-Pin TWBGA T/R - Tape and Reel (Alt: IS43DR16640B-25DBL) RoHS: Not Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 8 Weeks, 0 Days Container: Reel | 0 |
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$3.4625 / $4.2381 | Buy Now |
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DISTI #
IS43DR16640B-25DBL
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Avnet Americas | DRAM Chip DDR2 SDRAM 1G-Bit 64M x 16 1.8V 84-Pin TWBGA T/R - Tape and Reel (Alt: IS43DR16640B-25DBL) RoHS: Not Compliant Min Qty: 2500 Package Multiple: 2500 Lead time: 8 Weeks, 0 Days Container: Reel | 0 |
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$5.5875 / $6.8391 | Buy Now |
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DISTI #
870-I43DR16640B25DBL
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Mouser Electronics | DRAM 1G (64Mx16) 400MHz 1.8v DDR2 SDRAM | 74 |
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$4.1200 / $6.9400 | Buy Now |
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DISTI #
IS43DR16640B-25DBL
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Avnet Asia | DRAM, DDR2, 1 Gbit, 64M x 16bit, 400 MHz, 84 Pins, TWBGA (Alt: IS43DR16640B-25DBL) RoHS: Compliant Min Qty: 209 Package Multiple: 209 Lead time: 6 Weeks, 0 Days | 0 |
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RFQ | |
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DISTI #
IS43DR16640B-25DBL
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Avnet Silica | DRAM, DDR2, 1 Gbit, 64M x 16bit, 400 MHz, 84 Pins, TWBGA (Alt: IS43DR16640B-25DBL) RoHS: Compliant Min Qty: 209 Package Multiple: 209 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Buy Now |
Part Details for IS43DR16640B-25DBL
IS43DR16640B-25DBL CAD Models
IS43DR16640B-25DBL Part Data Attributes
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IS43DR16640B-25DBL
Integrated Silicon Solution Inc
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Datasheet
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Compare Parts:
IS43DR16640B-25DBL
Integrated Silicon Solution Inc
DDR DRAM, 64MX16, 0.4ns, CMOS, PBGA84, 8 X 12.50 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, TWBGA-84
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| Rohs Code | Yes | |
| Part Life Cycle Code | Not Recommended | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Package Description | TFBGA, BGA84,9X15,32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.32 | |
| Factory Lead Time | 8 Weeks | |
| Samacsys Manufacturer | Integrated Silicon Solution Inc. | |
| Access Mode | MULTI BANK PAGE BURST | |
| Access Time-Max | 0.4 ns | |
| Additional Feature | AUTO/SELF REFRESH | |
| Clock Frequency-Max (fCLK) | 400 MHz | |
| I/O Type | COMMON | |
| Interleaved Burst Length | 4,8 | |
| JESD-30 Code | R-PBGA-B84 | |
| JESD-609 Code | e1 | |
| Length | 12.5 mm | |
| Memory Density | 1073741824 bit | |
| Memory IC Type | DDR2 DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 84 | |
| Number of Words | 67108864 words | |
| Number of Words Code | 64000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 64MX16 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TFBGA | |
| Package Equivalence Code | BGA84,9X15,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
| Qualification Status | Not Qualified | |
| Refresh Cycles | 8192 | |
| Seated Height-Max | 1.2 mm | |
| Self Refresh | YES | |
| Sequential Burst Length | 4,8 | |
| Standby Current-Max | 0.015 A | |
| Supply Current-Max | 0.27 mA | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Width | 8 mm |