Part Details for IS35ML02G081-BLA1 by Integrated Silicon Solution Inc
Overview of IS35ML02G081-BLA1 by Integrated Silicon Solution Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| BLA1011-2 | Rochester Electronics LLC | BLA1011-2 - N-Channel LDMOS Avionics LDMOS Transistor (Ampleon Die) | |
| BLA1011-300 | Rochester Electronics LLC | BLA1011-300 - 300W LDMOS Avionics Power Transistor (Ampleon Die) | |
| BLA1011-10 | Rochester Electronics LLC | BLA1011-10 - N-Channel LDMOS Avionics LDMOS Transistor (Ampleon Die) |
Price & Stock for IS35ML02G081-BLA1
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
IS35ML02G081-BLA1
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Avnet Asia | SLC NAND Flash 2Gbit 256M X 8Bit Parallel 3.3V 63-Pin VFBGA (Alt: IS35ML02G081-BLA1) RoHS: Compliant Min Qty: 220 Package Multiple: 220 Lead time: 12 Weeks, 0 Days | 0 |
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RFQ |
Part Details for IS35ML02G081-BLA1
IS35ML02G081-BLA1 CAD Models
IS35ML02G081-BLA1 Part Data Attributes
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IS35ML02G081-BLA1
Integrated Silicon Solution Inc
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Datasheet
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IS35ML02G081-BLA1
Integrated Silicon Solution Inc
Flash, 256MX8, PBGA63, VFBGA-63
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| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Package Description | VFBGA-63 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| JESD-30 Code | R-PBGA-B63 | |
| Length | 11 mm | |
| Memory Density | 2147483648 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 63 | |
| Number of Words | 268435456 words | |
| Number of Words Code | 256000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256MX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programming Voltage | 3.3 V | |
| Seated Height-Max | 1 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Type | SLC NAND TYPE | |
| Width | 9 mm |