Part Details for IS27LV020-10PL by Integrated Silicon Solution Inc
Overview of IS27LV020-10PL by Integrated Silicon Solution Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Industrial Automation
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Renewable Energy
Entertainment and Gaming
Robotics and Drones
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
R5F10PLELFB#X5 | Renesas Electronics Corporation | Microcontrollers with Low Consumption Current for Automotive Applications | |
R5F10PLHKFB#X5 | Renesas Electronics Corporation | Microcontrollers with Low Consumption Current for Automotive Applications | |
R5F10PLEYFB#X5 | Renesas Electronics Corporation | Microcontrollers with Low Consumption Current for Automotive Applications |
Part Details for IS27LV020-10PL
IS27LV020-10PL CAD Models
IS27LV020-10PL Part Data Attributes
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IS27LV020-10PL
Integrated Silicon Solution Inc
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Datasheet
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IS27LV020-10PL
Integrated Silicon Solution Inc
OTP ROM, 256KX8, 100ns, CMOS, PQCC32, PLASTIC, LCC-32
|
Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
Part Package Code | QFJ | |
Package Description | PLASTIC, LCC-32 | |
Pin Count | 32 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.71 | |
Access Time-Max | 100 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-PQCC-J32 | |
JESD-609 Code | e0 | |
Length | 13.97 mm | |
Memory Density | 2097152 bit | |
Memory IC Type | OTP ROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 32 | |
Number of Words | 262144 words | |
Number of Words Code | 256000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 256KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | QCCJ | |
Package Equivalence Code | LDCC32,.5X.6 | |
Package Shape | RECTANGULAR | |
Package Style | CHIP CARRIER | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3.55 mm | |
Standby Current-Max | 0.00002 A | |
Supply Current-Max | 0.025 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | J BEND | |
Terminal Pitch | 1.27 mm | |
Terminal Position | QUAD | |
Width | 11.43 mm |