Part Details for IS25WP512M-JLLA3 by Integrated Silicon Solution Inc
Overview of IS25WP512M-JLLA3 by Integrated Silicon Solution Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for IS25WP512M-JLLA3
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
IS25WP512M-JLLA3
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Avnet Asia | NOR Flash 512Mbit 64M X 8bit Serial 1.8V 8-Pin WSON (Alt: IS25WP512M-JLLA3) RoHS: Compliant Min Qty: 480 Package Multiple: 480 Lead time: 12 Weeks, 0 Days | 0 |
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RFQ | |
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Win Source Electronics | 512Mb NOR Flash | 25970 |
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$5.4170 / $8.1250 | Buy Now |
Part Details for IS25WP512M-JLLA3
IS25WP512M-JLLA3 CAD Models
IS25WP512M-JLLA3 Part Data Attributes
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IS25WP512M-JLLA3
Integrated Silicon Solution Inc
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Datasheet
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IS25WP512M-JLLA3
Integrated Silicon Solution Inc
Flash, 64MX8, PDSO8, WSON-8
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Package Description | HVSON, | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Date Of Intro | 2017-07-17 | |
| Clock Frequency-Max (fCLK) | 133 MHz | |
| Data Retention Time-Min | 20 | |
| Endurance | 100000 Write/Erase Cycles | |
| JESD-30 Code | R-PDSO-N8 | |
| JESD-609 Code | e3 | |
| Length | 8 mm | |
| Memory Density | 536870912 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 8 | |
| Number of Words | 67108864 words | |
| Number of Words Code | 64000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 64MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HVSON | |
| Package Equivalence Code | SOLCC8,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programming Voltage | 1.8 V | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 0.8 mm | |
| Serial Bus Type | QSPI | |
| Standby Current-Max | 0.00026 A | |
| Supply Current-Max | 0.035 mA | |
| Supply Voltage-Max (Vsup) | 1.95 V | |
| Supply Voltage-Min (Vsup) | 1.65 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Tin (Sn) | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 10 | |
| Type | NOR TYPE | |
| Width | 6 mm | |
| Write Protection | HARDWARE/SOFTWARE |