Part Details for IS25LP512M-RHLA3 by Integrated Silicon Solution Inc
Overview of IS25LP512M-RHLA3 by Integrated Silicon Solution Inc
- Distributor Offerings: (6 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for IS25LP512M-RHLA3
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
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DISTI #
78AH8827
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Newark | 512Mb Qpi/Qspi, 24-Ball Tfbga 6X8Mm 5X5 Ball Array, Rohs, Reset Pin, Auto Grade |Integrated Silicon Solution (Issi) IS25LP512M-RHLA3 Min Qty: 480 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$6.0300 / $6.2100 | Buy Now |
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DISTI #
706-IS25LP512M-RHLA3-ND
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DigiKey | 512Mb QPI/QSPI, 24-ball TFBGA 6x Min Qty: 480 Lead time: 10 Weeks Container: Bulk | Temporarily Out of Stock |
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$6.6086 | Buy Now |
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DISTI #
IS25LP512M-RHLA3
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Avnet Americas | NOR Flash 512Mbit 64M X 8bit QPI/SPI 3V 8.5ns 24-Pin TFBGA - Trays (Alt: IS25LP512M-RHLA3) RoHS: Not Compliant Min Qty: 480 Package Multiple: 480 Lead time: 12 Weeks, 0 Days Container: Tray | 0 |
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$5.5375 / $6.7779 | Buy Now |
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DISTI #
870-IS25LP512M-RHLA3
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Mouser Electronics | NOR Flash 512Mb QPI/QSPI, 24-ball TFBGA 6x8mm 5x5 ball array, RoHS, reset pin, Auto Grade RoHS: Compliant | 0 |
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$5.9100 / $8.6400 | Order Now |
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DISTI #
SMC-IS25LP512M-RHLA3
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Sensible Micro Corporation | AS6081 Certified Vendor, 1 Yr Warranty RoHS: Not Compliant Min Qty: 25 Lead time: 2 Weeks, 0 Days | 95 |
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RFQ | |
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DISTI #
IS25LP512M-RHLA3
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Avnet Silica | NOR Flash 512Mbit 64M X 8bit QPI/SPI 3V 8.5ns 24-Pin TFBGA (Alt: IS25LP512M-RHLA3) RoHS: Compliant Min Qty: 480 Package Multiple: 480 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Buy Now |
Part Details for IS25LP512M-RHLA3
IS25LP512M-RHLA3 CAD Models
IS25LP512M-RHLA3 Part Data Attributes:
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IS25LP512M-RHLA3
Integrated Silicon Solution Inc
Buy Now
Datasheet
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Compare Parts:
IS25LP512M-RHLA3
Integrated Silicon Solution Inc
Flash, 64MX8, PBGA24, TFBGA-24
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Package Description | TBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Factory Lead Time | 12 Weeks | |
| Date Of Intro | 2017-07-17 | |
| Samacsys Manufacturer | Integrated Silicon Solution Inc. | |
| Alternate Memory Width | 1 | |
| Clock Frequency-Max (fCLK) | 133 MHz | |
| Data Retention Time-Min | 20 | |
| Endurance | 100000 Write/Erase Cycles | |
| JESD-30 Code | R-PBGA-B24 | |
| JESD-609 Code | e1 | |
| Length | 8 mm | |
| Memory Density | 536870912 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 67108864 words | |
| Number of Words Code | 64000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 64MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Equivalence Code | BGA24,5X5,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programming Voltage | 3 V | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1.2 mm | |
| Serial Bus Type | SPI | |
| Standby Current-Max | 0.00026 A | |
| Supply Current-Max | 0.035 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.3 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 10 | |
| Type | NOR TYPE | |
| Width | 6 mm | |
| Write Protection | HARDWARE/SOFTWARE |