Part Details for IS25LP256D-RGLE by Integrated Silicon Solution Inc
Overview of IS25LP256D-RGLE by Integrated Silicon Solution Inc
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Price & Stock for IS25LP256D-RGLE
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
IS25LP256D-RGLE-ND
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DigiKey | IC FLASH 256MBIT SERIAL Lead time: 16 Weeks Container: Tray | Temporarily Out of Stock |
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Buy Now | |
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DISTI #
870-IS25LP256D-RGLE
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Mouser Electronics | NOR Flash 256Mb QPI/QSPI, 24-ball TFBGA 6x8mm 4x6 ball array, RoHS, reset pin RoHS: Compliant | 106 |
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$3.7200 / $4.8100 | Buy Now |
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DISTI #
IS25LP256D-RGLE
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Avnet Silica | 256Mb QPI/QSPI, 24-ball TFBGA 6x8mm 4x6 ball array, RoHS, reset pin (Alt: IS25LP256D-RGLE) RoHS: Compliant Min Qty: 480 Package Multiple: 480 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Buy Now |
Part Details for IS25LP256D-RGLE
IS25LP256D-RGLE CAD Models
IS25LP256D-RGLE Part Data Attributes
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IS25LP256D-RGLE
Integrated Silicon Solution Inc
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Datasheet
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IS25LP256D-RGLE
Integrated Silicon Solution Inc
Flash, 32MX8, PBGA24, TFBGA-24
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Package Description | TBGA, | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Date Of Intro | 2016-04-12 | |
| Samacsys Manufacturer | Integrated Silicon Solution Inc. | |
| Clock Frequency-Max (fCLK) | 166 MHz | |
| Data Retention Time-Min | 20 | |
| Endurance | 100000 Write/Erase Cycles | |
| JESD-30 Code | R-PBGA-B24 | |
| Length | 8 mm | |
| Memory Density | 268435456 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Number of Words | 33554432 words | |
| Number of Words Code | 32000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 105 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 32MX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TBGA | |
| Package Equivalence Code | BGA24,4X6,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, THIN PROFILE | |
| Parallel/Serial | SERIAL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Programming Voltage | 3 V | |
| Seated Height-Max | 1.2 mm | |
| Serial Bus Type | QSPI | |
| Standby Current-Max | 0.00009 A | |
| Supply Current-Max | 0.03 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.3 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Type | NOR TYPE | |
| Width | 6 mm | |
| Write Protection | HARDWARE/SOFTWARE |