There are no models available for this part yet.
Overview of IS25LP064A-JGLE by Integrated Silicon Solution Inc
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 2 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Price & Stock for IS25LP064A-JGLE by Integrated Silicon Solution Inc
Part # | Manufacturer | Description | Stock | Price | Buy | ||
---|---|---|---|---|---|---|---|
DISTI #
706-1642-ND
|
DigiKey | IC FLASH 64MBIT SPI/QUAD 24TFBGA Lead time: 18 Weeks Container: Bulk | Temporarily Out of Stock |
|
Buy Now | ||
DISTI #
870-IS25LP064A-JGLE
|
Mouser Electronics | NOR Flash 64M 3V 133MHz Serial Flash RoHS: Compliant | 0 |
|
Order Now |
CAD Models for IS25LP064A-JGLE by Integrated Silicon Solution Inc
Part Data Attributes for IS25LP064A-JGLE by Integrated Silicon Solution Inc
|
|
---|---|
Rohs Code
|
Yes
|
Part Life Cycle Code
|
Active
|
Ihs Manufacturer
|
INTEGRATED SILICON SOLUTION INC
|
Package Description
|
TBGA, BGA24,4X6,40
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.51
|
Samacsys Manufacturer
|
Integrated Silicon Solution Inc.
|
Alternate Memory Width
|
1
|
Clock Frequency-Max (fCLK)
|
133 MHz
|
Data Retention Time-Min
|
20
|
Endurance
|
100000 Write/Erase Cycles
|
JESD-30 Code
|
R-PBGA-B24
|
JESD-609 Code
|
e1
|
Length
|
8 mm
|
Memory Density
|
67108864 bit
|
Memory IC Type
|
FLASH
|
Memory Width
|
8
|
Number of Functions
|
1
|
Number of Terminals
|
24
|
Number of Words
|
8388608 words
|
Number of Words Code
|
8000000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
105 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
8MX8
|
Output Characteristics
|
3-STATE
|
Package Body Material
|
PLASTIC/EPOXY
|
Package Code
|
TBGA
|
Package Equivalence Code
|
BGA24,4X6,40
|
Package Shape
|
RECTANGULAR
|
Package Style
|
GRID ARRAY, THIN PROFILE
|
Parallel/Serial
|
SERIAL
|
Peak Reflow Temperature (Cel)
|
260
|
Programming Voltage
|
3 V
|
Seated Height-Max
|
1.2 mm
|
Serial Bus Type
|
SPI
|
Standby Current-Max
|
0.000035 A
|
Supply Current-Max
|
0.025 mA
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
Supply Voltage-Min (Vsup)
|
2.3 V
|
Supply Voltage-Nom (Vsup)
|
3 V
|
Surface Mount
|
YES
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Finish
|
TIN SILVER COPPER
|
Terminal Form
|
BALL
|
Terminal Pitch
|
1 mm
|
Terminal Position
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s)
|
10
|
Type
|
NOR TYPE
|
Width
|
6 mm
|
Write Protection
|
HARDWARE/SOFTWARE
|
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