Part Details for IS25C01-2PI by Integrated Silicon Solution Inc
Overview of IS25C01-2PI by Integrated Silicon Solution Inc
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for IS25C01-2PI
IS25C01-2PI CAD Models
IS25C01-2PI Part Data Attributes
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IS25C01-2PI
Integrated Silicon Solution Inc
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IS25C01-2PI
Integrated Silicon Solution Inc
EEPROM, 128X8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
Part Package Code | DIP | |
Package Description | 0.300 INCH, PLASTIC, DIP-8 | |
Pin Count | 8 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.51 | |
Clock Frequency-Max (fCLK) | 10 MHz | |
Data Retention Time-Min | 100 | |
Endurance | 1000000 Write/Erase Cycles | |
JESD-30 Code | R-PDIP-T8 | |
JESD-609 Code | e0 | |
Length | 9.325 mm | |
Memory Density | 1024 bit | |
Memory IC Type | EEPROM | |
Memory Width | 8 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Number of Words | 128 words | |
Number of Words Code | 128 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 128X8 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | DIP | |
Package Equivalence Code | DIP8,.3 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE | |
Parallel/Serial | SERIAL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 4.57 mm | |
Serial Bus Type | SPI | |
Standby Current-Max | 5e-7 A | |
Supply Current-Max | 0.005 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 1.8 V | |
Supply Voltage-Nom (Vsup) | 2.5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 7.62 mm | |
Write Cycle Time-Max (tWC) | 5 ms | |
Write Protection | HARDWARE |