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Flash, 128GX8, PBGA153, FBGA-153
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
47AK0317
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Newark | 128Gb, 153 Ball Fbga, 3.3V, Rohs |Integrated Silicon Solution (Issi) IS21TF128G-JCLI RoHS: Not Compliant Min Qty: 152 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
|
$65.2400 | Buy Now |
DISTI #
706-IS21TF128G-JCLI-ND
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DigiKey | IC FLASH 1TBIT EMMC 153VFBGA Min Qty: 1 Lead time: 8 Weeks Container: Bulk |
54 In Stock |
|
$71.7634 / $87.9300 | Buy Now |
DISTI #
IS21TF128G-JCLI
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Avnet Americas | Flash Card 128G-bytes 3.3V eMMC NAND Flash(TLC) 153-Pin FBGA - Trays (Alt: IS21TF128G-JCLI) RoHS: Not Compliant Min Qty: 152 Package Multiple: 152 Lead time: 8 Weeks, 0 Days Container: Tray | 0 |
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$57.0210 | Buy Now |
DISTI #
870-IS21TF128G-JCLI
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Mouser Electronics | eMMC 128GB, 153 Ball FBGA, 33V, RoHS RoHS: Compliant | 0 |
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$71.1100 / $87.9000 | Order Now |
DISTI #
IS21TF128G-JCLI
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Avnet Silica | Flash Card 128G-bytes 3.3V eMMC NAND Flash(TLC) 153-Pin FBGA (Alt: IS21TF128G-JCLI) RoHS: Compliant Min Qty: 152 Package Multiple: 152 Lead time: 14 Weeks, 0 Days | Silica - 0 |
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Buy Now |
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IS21TF128G-JCLI
Integrated Silicon Solution Inc
Buy Now
Datasheet
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Compare Parts:
IS21TF128G-JCLI
Integrated Silicon Solution Inc
Flash, 128GX8, PBGA153, FBGA-153
|
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
Package Description | FBGA-153 | |
Reach Compliance Code | compliant | |
Factory Lead Time | 8 Weeks | |
Samacsys Manufacturer | Integrated Silicon Solution Inc. | |
Clock Frequency-Max (fCLK) | 200 MHz | |
JESD-30 Code | R-PBGA-B153 | |
JESD-609 Code | e1 | |
Length | 13 mm | |
Memory Density | 1099511627776 bit | |
Memory IC Type | FLASH | |
Memory Width | 8 | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Terminals | 153 | |
Number of Words | 137438953472 words | |
Number of Words Code | 128000000000 | |
Operating Mode | SYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 128GX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Equivalence Code | BGA153,14X14,20 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Parallel/Serial | SERIAL | |
Peak Reflow Temperature (Cel) | 260 | |
Programming Voltage | 3.3 V | |
Seated Height-Max | 1 mm | |
Standby Current-Max | 0.00008 A | |
Supply Current-Max | 0.06 mA | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 2.7 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.5 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Type | TLC NAND TYPE | |
Width | 11.5 mm | |
Write Protection | HARDWARE/SOFTWARE |