-
Part Symbol
-
Footprint
-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
Part Details for IS21ES64G-JQLI by Integrated Silicon Solution Inc
Overview of IS21ES64G-JQLI by Integrated Silicon Solution Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Industrial Automation
Automotive
Price & Stock for IS21ES64G-JQLI
| Part # | Distributor | Description | Stock | Price | Buy | |
|---|---|---|---|---|---|---|
|
DISTI #
706-IS21ES64G-JQLI-ND
|
DigiKey | IC FLASH 512GBIT EMMC 100LFBGA Lead time: 18 Weeks Container: Tray | Limited Supply - Call |
|
Buy Now |
Part Details for IS21ES64G-JQLI
IS21ES64G-JQLI CAD Models
IS21ES64G-JQLI Part Data Attributes:
|
|
IS21ES64G-JQLI
Integrated Silicon Solution Inc
Buy Now
Datasheet
|
Compare Parts:
IS21ES64G-JQLI
Integrated Silicon Solution Inc
Flash, 64GX8, PBGA100, FBGA-100
|
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEGRATED SILICON SOLUTION INC | |
| Package Description | LBGA, BGA100,12X17,40 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Factory Lead Time | 53 Weeks, 1 Day | |
| Date Of Intro | 2016-10-24 | |
| Samacsys Manufacturer | Integrated Silicon Solution Inc. | |
| Alternate Memory Width | 4 | |
| Clock Frequency-Max (fCLK) | 200 MHz | |
| Command User Interface | NO | |
| Data Polling | NO | |
| JESD-30 Code | R-PBGA-B100 | |
| JESD-609 Code | e1 | |
| Length | 18 mm | |
| Memory Density | 549755813888 bit | |
| Memory IC Type | FLASH | |
| Memory Width | 8 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 100 | |
| Number of Words | 68719476736 words | |
| Number of Words Code | 64000000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 64GX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA100,12X17,40 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Programming Voltage | 3.3 V | |
| Seated Height-Max | 1.4 mm | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 10 | |
| Toggle Bit | NO | |
| Type | MLC NAND TYPE | |
| Width | 14 mm |