Datasheets
IS21ES08G-JCLI by: Integrated Silicon Solution Inc

Flash, 8GX8, PBGA153, FBGA-153

Part Details for IS21ES08G-JCLI by Integrated Silicon Solution Inc

Overview of IS21ES08G-JCLI by Integrated Silicon Solution Inc

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Applications Consumer Electronics Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

Price & Stock for IS21ES08G-JCLI

Part # Distributor Description Stock Price Buy
DISTI # 706-1641-ND
DigiKey IC FLASH 64GBIT EMMC 153VFBGA Lead time: 6 Weeks Container: Tray Limited Supply - Call
Buy Now
Bristol Electronics   301
RFQ
Quest Components FLASH, 8GX8, PBGA153 2
  • 1 $15.7000
$15.7000 Buy Now
NexGen Digital   1
RFQ
DISTI # IS21ES08G-JCLI
Avnet Asia NAND Flash Memory with eMMC 5.0 Interface 8GB 0-200MHz Industrial Grade -40 to 85°C 153-Ball FBGA (Alt: IS21ES08G-JCLI) RoHS: Compliant Min Qty: 152 Package Multiple: 152 Lead time: 14 Weeks, 0 Days 0
RFQ
Win Source Electronics IC FLASH 64GBIT EMMC 153VFBGA 9153
  • 2 $31.0870
  • 4 $25.5080
  • 7 $24.7110
  • 9 $23.9130
  • 11 $23.1160
  • 15 $20.7250
$20.7250 / $31.0870 Buy Now

Part Details for IS21ES08G-JCLI

IS21ES08G-JCLI CAD Models

IS21ES08G-JCLI Part Data Attributes:

IS21ES08G-JCLI Integrated Silicon Solution Inc
Buy Now Datasheet
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IS21ES08G-JCLI Integrated Silicon Solution Inc Flash, 8GX8, PBGA153, FBGA-153
Rohs Code Yes
Part Life Cycle Code End Of Life
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC
Package Description VFBGA, BGA153,14X14,20
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Date Of Intro 2016-09-13
Samacsys Manufacturer Integrated Silicon Solution Inc.
Alternate Memory Width 1
Clock Frequency-Max (fCLK) 200 MHz
Command User Interface NO
Data Polling NO
JESD-30 Code R-PBGA-B153
JESD-609 Code e1
Length 13 mm
Memory Density 68719476736 bit
Memory IC Type FLASH
Memory Width 8
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 153
Number of Words 8589934592 words
Number of Words Code 8000000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 8GX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Equivalence Code BGA153,14X14,20
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 260
Programming Voltage 3.3 V
Seated Height-Max 1 mm
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 0.5 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 10
Toggle Bit NO
Type MLC NAND TYPE
Width 11.5 mm

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