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Memory / Flash Memories / IS21EF08G-JCLI
Datasheets
IS21EF08G-JCLI by: Integrated Silicon Solution Inc

8GX8, PBGA153, FBGA-153

Part Details for IS21EF08G-JCLI by Integrated Silicon Solution Inc

Results Overview of IS21EF08G-JCLI by Integrated Silicon Solution Inc

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

IS21EF08G-JCLI Information

IS21EF08G-JCLI by Integrated Silicon Solution Inc is a Flash Memory.
Flash Memories are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Price & Stock for IS21EF08G-JCLI

Part # Distributor Description Stock Price Buy
DISTI # 706-IS21EF08G-JCLI-ND
DigiKey IC FLASH 64MBIT EMMC 153FBGA Min Qty: 1 Lead time: 10 Weeks Container: Tray 100
In Stock
  • 1 $12.9000
  • 10 $8.9000
  • 25 $7.8580
  • 80 $6.8422
  • 230 $6.4375
$6.4375 / $12.9000 Buy Now
DISTI # IS21EF08G-JCLI
Avnet Americas 8GB/16GB eMMC with MLC NAND/eMMC 5.1 Interface - Trays (Alt: IS21EF08G-JCLI) RoHS: Not Compliant Min Qty: 152 Package Multiple: 152 Lead time: 10 Weeks, 0 Days Container: Tray 0
  • 152 $6.3014
  • 304 $6.2693
  • 608 $6.2371
  • 912 $6.2050
  • 1,216 $6.1728
$6.1728 / $6.3014 Buy Now
DISTI # 870-IS21EF08G-JCLI
Mouser Electronics eMMC 8GB, 153 Ball FBGA, 3.3V, RoHS RoHS: Compliant 267
  • 1 $11.3700
  • 10 $8.9000
  • 25 $7.8600
  • 50 $6.8500
  • 100 $6.4400
  • 250 $6.4300
$6.4300 / $11.3700 Buy Now
DISTI # IS21EF08G-JCLI
Avnet Asia 8GB/16GB eMMC with MLC NAND/eMMC 5.1 Interface (Alt: IS21EF08G-JCLI) RoHS: Compliant Min Qty: 152 Package Multiple: 152 Lead time: 10 Weeks, 0 Days 0
RFQ
DISTI # IS21EF08G-JCLI
Avnet Silica 8GB16GB eMMC with MLC NANDeMMC 51 Interface (Alt: IS21EF08G-JCLI) RoHS: Compliant Min Qty: 152 Package Multiple: 152 Lead time: 28 Weeks, 0 Days Silica - 0
Buy Now
DISTI # IS21EF08G-JCLI
EBV Elektronik 8GB16GB eMMC with MLC NANDeMMC 51 Interface (Alt: IS21EF08G-JCLI) RoHS: Compliant Min Qty: 152 Package Multiple: 152 Lead time: 27 Weeks, 0 Days EBV - 0
Buy Now

Part Details for IS21EF08G-JCLI

IS21EF08G-JCLI CAD Models

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IS21EF08G-JCLI Part Data Attributes

Parametric Data
IS21EF08G-JCLI Integrated Silicon Solution Inc
Buy Now Datasheet
Compare Parts:
IS21EF08G-JCLI Integrated Silicon Solution Inc 8GX8, PBGA153, FBGA-153
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Rohs Code Yes
Part Life Cycle Code Active
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC
Package Description FBGA-153
Reach Compliance Code compliant
Factory Lead Time 10 Weeks
Samacsys Manufacturer Integrated Silicon Solution Inc.
Clock Frequency-Max (fCLK) 200 MHz
JESD-30 Code R-PBGA-B153
JESD-609 Code e1
Length 13 mm
Memory Density 68719476736 bit
Memory IC Type Embedded MMC
Memory Width 8
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 153
Number of Words 8589934592 words
Number of Words Code 8000000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 8GX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Equivalence Code BGA153,14X14,20
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial SERIAL
Programming Voltage 3.3 V
Seated Height-Max 1 mm
Serial Bus Type EMMC 5.1
Standby Current-Max 0.00004 A
Supply Current-Max 0.045 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V
Surface Mount YES
Technology CMOS
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL
Terminal Pitch 0.5 mm
Terminal Position BOTTOM
Type MLC NAND TYPE
Width 11.5 mm
Write Protection SOFTWARE

IS21EF08G-JCLI Frequently Asked Questions (FAQ)

  • The recommended PCB layout for optimal performance can be found in the IS21EF08G-JCLI application note or evaluation board documentation, which provides guidelines for component placement, routing, and thermal management.

  • Thermal management for the IS21EF08G-JCLI involves providing adequate heat dissipation through the use of heat sinks, thermal vias, and thermal pads. The device's thermal characteristics, such as junction-to-ambient thermal resistance, can be found in the datasheet.

  • The recommended power-up and power-down sequences for the IS21EF08G-JCLI can be found in the datasheet or application note, and typically involve a specific order of powering up/down the VCC, VDD, and other supply voltages to prevent damage or malfunction.

  • Troubleshooting issues with the IS21EF08G-JCLI involves using a systematic approach to identify the root cause of the problem, such as checking power supply voltages, signal integrity, and device configuration. ISSI also provides technical support and resources to help with troubleshooting.

  • The environmental and operating conditions for the IS21EF08G-JCLI, such as temperature range, humidity, and vibration, can be found in the datasheet and are typically specified for commercial or industrial operating conditions.