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5.5-V single-Supply, 550-KHz (G=10), 6.5-V/µs slew rate, 1-mV offset, RRO, CMOS instrumentation a 8-VSSOP -40 to 85
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Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
INA155ECT-ND
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DigiKey | IC INST AMP 1 CIRCUIT 8VSSOP Min Qty: 1 Lead time: 6 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) |
398 In Stock |
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$1.8430 / $3.6700 | Buy Now |
DISTI #
595-INA155E/250
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Mouser Electronics | Instrumentation Amplifiers R/R CMOS Inst RoHS: Compliant | 2038 |
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$1.8400 / $3.6700 | Buy Now |
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Rochester Electronics | INA155 Single-Supply, Rail-to-Rail Output, CMOS Instrumentation Amplifier RoHS: Compliant Status: Active Min Qty: 1 | 7 |
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$1.7000 / $2.0000 | Buy Now |
DISTI #
INA155E/250
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TME | IC: instrumentation amplifier, 550kHz, Ch: 1, VSSOP8, 10V/V,50V/V Min Qty: 1 | 0 |
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$2.3700 / $4.0300 | RFQ |
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Ameya Holding Limited | INA155E/250 仪表放大器, 1mV偏置, 92dB CMRR, 轨至轨输出, 3 V 5 V电源, 8针 MSOP封装 | 11745 |
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RFQ |
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INA155E/250
Texas Instruments
Buy Now
Datasheet
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INA155E/250
Texas Instruments
5.5-V single-Supply, 550-KHz (G=10), 6.5-V/µs slew rate, 1-mV offset, RRO, CMOS instrumentation a 8-VSSOP -40 to 85
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Part Package Code | MSOP | |
Package Description | MSOP-8 | |
Pin Count | 8 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.33.00.01 | |
Samacsys Manufacturer | Texas Instruments | |
Amplifier Type | INSTRUMENTATION AMPLIFIER | |
Average Bias Current-Max (IIB) | 0.00001 µA | |
Bandwidth (3dB)-Nom | 0.55 MHz | |
Bias Current-Max (IIB) @25C | 0.00001 µA | |
Common-mode Reject Ratio-Min | 92 dB | |
Input Offset Current-Max (IIO) | 0.00001 µA | |
Input Offset Voltage-Max | 1000 µV | |
JESD-30 Code | S-PDSO-G8 | |
JESD-609 Code | e4 | |
Length | 3 mm | |
Moisture Sensitivity Level | 2 | |
Non-linearity-Max | 0.015% | |
Number of Functions | 1 | |
Number of Terminals | 8 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP8,.19 | |
Package Shape | SQUARE | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Packing Method | TR | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.1 mm | |
Slew Rate-Nom | 6.5 V/us | |
Supply Current-Max | 2.8 mA | |
Supply Voltage Limit-Max | 7.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | NICKEL PALLADIUM GOLD | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Voltage Gain-Max | 50 | |
Voltage Gain-Min | 10 | |
Voltage Gain-Nom | 10 | |
Width | 3 mm |