Part Details for IM5623MFE by General Electric Solid State
Overview of IM5623MFE by General Electric Solid State
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- Part Data Attributes: (Available)
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Applications
Computing and Data Storage
Electronic Manufacturing
Part Details for IM5623MFE
IM5623MFE CAD Models
IM5623MFE Part Data Attributes
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IM5623MFE
General Electric Solid State
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Datasheet
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IM5623MFE
General Electric Solid State
OTP ROM, 256X4, 80ns, TTL, CDFP16
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | GENERAL ELECTRIC SOLID STATE | |
| Package Description | DFP, FL16,.3 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 200 ns | |
| JESD-30 Code | R-XDFP-F16 | |
| JESD-609 Code | e0 | |
| Memory Density | 524288 bit | |
| Memory IC Type | OTP ROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 16 | |
| Number of Words | 256 words | |
| Number of Words Code | 64000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 64KX8 | |
| Package Body Material | CERAMIC | |
| Package Code | DFP | |
| Package Equivalence Code | FL16,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | FLATPACK | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Supply Current-Max | 0.04 mA | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | TTL | |
| Temperature Grade | MILITARY | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | FLAT | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL |