Part Details for IDTQS3VH862PG by Integrated Device Technology Inc
Overview of IDTQS3VH862PG by Integrated Device Technology Inc
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- Part Data Attributes: (Available)
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Applications
Industrial Automation
Medical Imaging
Part Details for IDTQS3VH862PG
IDTQS3VH862PG CAD Models
IDTQS3VH862PG Part Data Attributes
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IDTQS3VH862PG
Integrated Device Technology Inc
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Datasheet
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IDTQS3VH862PG
Integrated Device Technology Inc
Bus Driver, 1-Func, 10-Bit, True Output, CMOS, PDSO24, TSSOP-24
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
Part Package Code | TSSOP | |
Package Description | TSSOP, TSSOP24,.25 | |
Pin Count | 24 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.39.00.01 | |
Family | CBT/FST/QS/5C/B | |
JESD-30 Code | R-PDSO-G24 | |
JESD-609 Code | e0 | |
Length | 7.8 mm | |
Logic IC Type | BUS DRIVER | |
Moisture Sensitivity Level | 1 | |
Number of Bits | 10 | |
Number of Functions | 1 | |
Number of Ports | 2 | |
Number of Terminals | 24 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Output Characteristics | 3-STATE | |
Output Polarity | TRUE | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TSSOP | |
Package Equivalence Code | TSSOP24,.25 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
Peak Reflow Temperature (Cel) | 240 | |
Propagation Delay (tpd) | 0.2 ns | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.2 mm | |
Supply Voltage-Max (Vsup) | 3.6 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Supply Voltage-Nom (Vsup) | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | GULL WING | |
Terminal Pitch | 0.65 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | 20 | |
Width | 4.4 mm |