Part Details for IDT74SSTUA32866BFG8 by Integrated Device Technology Inc
Overview of IDT74SSTUA32866BFG8 by Integrated Device Technology Inc
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Applications
Internet of Things (IoT)
Computing and Data Storage
Agriculture Technology
Part Details for IDT74SSTUA32866BFG8
IDT74SSTUA32866BFG8 CAD Models
IDT74SSTUA32866BFG8 Part Data Attributes
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IDT74SSTUA32866BFG8
Integrated Device Technology Inc
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Datasheet
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IDT74SSTUA32866BFG8
Integrated Device Technology Inc
PLL Based Clock Driver, SSTU Series, 1 True Output(s), 0 Inverted Output(s), CMOS, PBGA96, GREEN, LFBGA-96
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
Part Package Code | BGA | |
Package Description | LFBGA, BGA96,6X16,32 | |
Pin Count | 96 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.39.00.01 | |
Family | SSTU | |
Input Conditioning | DIFFERENTIAL | |
JESD-30 Code | R-PBGA-B96 | |
JESD-609 Code | e1 | |
Length | 13.5 mm | |
Logic IC Type | PLL BASED CLOCK DRIVER | |
Moisture Sensitivity Level | 3 | |
Number of Functions | 1 | |
Number of Inverted Outputs | ||
Number of Terminals | 96 | |
Number of True Outputs | 1 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Package Body Material | PLASTIC/EPOXY | |
Package Code | LFBGA | |
Package Equivalence Code | BGA96,6X16,32 | |
Package Shape | RECTANGULAR | |
Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Propagation Delay (tpd) | 1.9 ns | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.5 mm | |
Supply Voltage-Max (Vsup) | 1.9 V | |
Supply Voltage-Min (Vsup) | 1.7 V | |
Supply Voltage-Nom (Vsup) | 1.8 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
Terminal Form | BALL | |
Terminal Pitch | 0.8 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 5.5 mm | |
fmax-Min | 410 MHz |