Part Details for IDT74FST163232PA8 by Integrated Device Technology Inc
Overview of IDT74FST163232PA8 by Integrated Device Technology Inc
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Part Details for IDT74FST163232PA8
IDT74FST163232PA8 CAD Models
IDT74FST163232PA8 Part Data Attributes
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IDT74FST163232PA8
Integrated Device Technology Inc
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IDT74FST163232PA8
Integrated Device Technology Inc
Bus Exchanger, CBT/FST/QS/5C/B Series, 1-Func, 16-Bit, True Output, CMOS, PDSO56, TSSOP-56
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | TSSOP | |
| Package Description | TSSOP, TSSOP56,.3,20 | |
| Pin Count | 56 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| Family | CBT/FST/QS/5C/B | |
| JESD-30 Code | R-PDSO-G56 | |
| JESD-609 Code | e0 | |
| Length | 14 mm | |
| Logic IC Type | BUS EXCHANGER | |
| Moisture Sensitivity Level | 1 | |
| Number of Bits | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 3 | |
| Number of Terminals | 56 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Characteristics | 3-STATE | |
| Output Polarity | TRUE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP56,.3,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Peak Reflow Temperature (Cel) | 240 | |
| Propagation Delay (tpd) | 0.25 ns | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.1 mm | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Width | 6.1 mm |