Datasheets
IDT72T6360L7-5BBI by: Integrated Device Technology Inc

Microprocessor Circuit, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324

Part Details for IDT72T6360L7-5BBI by Integrated Device Technology Inc

Results Overview of IDT72T6360L7-5BBI by Integrated Device Technology Inc

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Applications Internet of Things (IoT) Computing and Data Storage Agriculture Technology

IDT72T6360L7-5BBI Information

IDT72T6360L7-5BBI by Integrated Device Technology Inc is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.

Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.

Available Datasheets

Part # Manufacturer Description Datasheet
72T3655L5BBI Renesas Electronics Corporation 2K x 36 TeraSync FIFO, 2.5V
72T18125L5BBI Renesas Electronics Corporation 512K x 18 / 1M x 9 TeraSync FIFO, 2.5V
72T1885L5BBI Renesas Electronics Corporation 32K x 18 / 64K x 9 TeraSync FIFO, 2.5V

Part Details for IDT72T6360L7-5BBI

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IDT72T6360L7-5BBI Part Data Attributes

IDT72T6360L7-5BBI Integrated Device Technology Inc
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IDT72T6360L7-5BBI Integrated Device Technology Inc Microprocessor Circuit, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324
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Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA
Package Description 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324
Pin Count 324
Reach Compliance Code not_compliant
HTS Code 8542.31.00.01
JESD-30 Code S-PBGA-B324
JESD-609 Code e0
Moisture Sensitivity Level 3
Number of Terminals 324
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA324,18X18,40
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified
Supply Current-Max 650 mA
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
Supply Voltage-Nom 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT