Part Details for IDT72T6360L7-5BBI by Integrated Device Technology Inc
Results Overview of IDT72T6360L7-5BBI by Integrated Device Technology Inc
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- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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IDT72T6360L7-5BBI Information
IDT72T6360L7-5BBI by Integrated Device Technology Inc is an Other uP/uC/Peripheral IC.
Other uPs/uCs/Peripheral ICs are under the broader part category of Microcontrollers and Processors.
Microcontrollers (MCUs) are small, low-power integrated circuits used to control embedded systems. Microcontrollers are primarily used to automate and control devices. Read more about Microcontrollers and Processors on our Microcontrollers and Processors part category page.
Available Datasheets
Part # | Manufacturer | Description | Datasheet |
---|---|---|---|
72T3655L5BBI | Renesas Electronics Corporation | 2K x 36 TeraSync FIFO, 2.5V | |
72T18125L5BBI | Renesas Electronics Corporation | 512K x 18 / 1M x 9 TeraSync FIFO, 2.5V | |
72T1885L5BBI | Renesas Electronics Corporation | 32K x 18 / 64K x 9 TeraSync FIFO, 2.5V |
Part Details for IDT72T6360L7-5BBI
IDT72T6360L7-5BBI CAD Models
IDT72T6360L7-5BBI Part Data Attributes
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IDT72T6360L7-5BBI
Integrated Device Technology Inc
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IDT72T6360L7-5BBI
Integrated Device Technology Inc
Microprocessor Circuit, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
Part Package Code | BGA | |
Package Description | 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-324 | |
Pin Count | 324 | |
Reach Compliance Code | not_compliant | |
HTS Code | 8542.31.00.01 | |
JESD-30 Code | S-PBGA-B324 | |
JESD-609 Code | e0 | |
Moisture Sensitivity Level | 3 | |
Number of Terminals | 324 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA324,18X18,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 225 | |
Qualification Status | Not Qualified | |
Supply Current-Max | 650 mA | |
Supply Voltage-Max | 2.625 V | |
Supply Voltage-Min | 2.375 V | |
Supply Voltage-Nom | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |