Datasheets
IDT72T18115L4-4BB by: Integrated Device Technology Inc

FIFO, 256KX18, 3.4ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240

Part Details for IDT72T18115L4-4BB by Integrated Device Technology Inc

Overview of IDT72T18115L4-4BB by Integrated Device Technology Inc

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Part Details for IDT72T18115L4-4BB

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IDT72T18115L4-4BB Part Data Attributes:

IDT72T18115L4-4BB Integrated Device Technology Inc
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IDT72T18115L4-4BB Integrated Device Technology Inc FIFO, 256KX18, 3.4ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240
Pbfree Code No
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code BGA
Package Description BGA, BGA240,18X18,40
Pin Count 240
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 3.4 ns
Additional Feature ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE
Alternate Memory Width 9
Clock Frequency-Max (fCLK) 100 MHz
Cycle Time 4.44 ns
JESD-30 Code S-PBGA-B240
JESD-609 Code e0
Length 19 mm
Memory Density 4718592 bit
Memory IC Type OTHER FIFO
Memory Width 18
Moisture Sensitivity Level 3
Number of Functions 1
Number of Terminals 240
Number of Words 262144 words
Number of Words Code 256000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 256KX18
Output Enable YES
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA240,18X18,40
Package Shape SQUARE
Package Style GRID ARRAY
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) 225
Qualification Status Not Qualified
Seated Height-Max 1.97 mm
Standby Current-Max 0.02 A
Supply Current-Max 0.07 mA
Supply Voltage-Max (Vsup) 2.625 V
Supply Voltage-Min (Vsup) 2.375 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 19 mm

Alternate Parts for IDT72T18115L4-4BB

This table gives cross-reference parts and alternative options found for IDT72T18115L4-4BB. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IDT72T18115L4-4BB, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
72T18115L4-4BB PBGA-240, Tray Integrated Device Technology Inc IDT72T18115L4-4BB vs 72T18115L4-4BB
72T18115L4-4BB 256K x 18 / 512K x 9 TeraSync FIFO, 2.5V, PBGA84/Tray Renesas Electronics Corporation IDT72T18115L4-4BB vs 72T18115L4-4BB
72T18115L4-4BBG FIFO, 256KX18, 3.4ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 Integrated Device Technology Inc IDT72T18115L4-4BB vs 72T18115L4-4BBG
72T18115L4-4BBGI FIFO, 256KX18, 3.4ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 Integrated Device Technology Inc IDT72T18115L4-4BB vs 72T18115L4-4BBGI
IDT72T18115L39176BB FIFO, 256KX18, 3.4ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 Integrated Device Technology Inc IDT72T18115L4-4BB vs IDT72T18115L39176BB
IDT72T18115L4-4BBG FIFO, 256KX18, 3.4ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 Integrated Device Technology Inc IDT72T18115L4-4BB vs IDT72T18115L4-4BBG
Part Number Description Manufacturer Compare
IDT72T18115L6-7BB FIFO, 256KX18, 3.8ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 Integrated Device Technology Inc IDT72T18115L4-4BB vs IDT72T18115L6-7BB
IDT72T18115L39240BB FIFO, 256KX18, 3.8ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 Integrated Device Technology Inc IDT72T18115L4-4BB vs IDT72T18115L39240BB
72T18115L4-4BB PBGA-240, Tray Integrated Device Technology Inc IDT72T18115L4-4BB vs 72T18115L4-4BB
IDT72T18115L6-7BBG FIFO, 256KX18, 3.8ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 Integrated Device Technology Inc IDT72T18115L4-4BB vs IDT72T18115L6-7BBG
IDT72T18115L39176BB FIFO, 256KX18, 3.4ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 Integrated Device Technology Inc IDT72T18115L4-4BB vs IDT72T18115L39176BB
72T18115L5BBGI FIFO, 256KX18, 3.6ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 Integrated Device Technology Inc IDT72T18115L4-4BB vs 72T18115L5BBGI
72T18115L6-7BBG FIFO, 256KX18, 3.8ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 Integrated Device Technology Inc IDT72T18115L4-4BB vs 72T18115L6-7BBG
72T18115L4-4BBGI FIFO, 256KX18, 3.4ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 Integrated Device Technology Inc IDT72T18115L4-4BB vs 72T18115L4-4BBGI
72T18115L6-7BB 256K x 18 / 512K x 9 TeraSync FIFO, 2.5V, PBGA84/Tray Renesas Electronics Corporation IDT72T18115L4-4BB vs 72T18115L6-7BB
IDT72T18115L5BBG FIFO, 256KX18, 3.6ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 Integrated Device Technology Inc IDT72T18115L4-4BB vs IDT72T18115L5BBG

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