There are no models available for this part yet.
Overview of IDT72T18105L5BBI by Integrated Device Technology Inc
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 5 crosses )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 crosses )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
CAD Models for IDT72T18105L5BBI by Integrated Device Technology Inc
Part Data Attributes for IDT72T18105L5BBI by Integrated Device Technology Inc
|
|
|
|---|---|
|
Pbfree Code
|
No
|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Transferred
|
|
Ihs Manufacturer
|
INTEGRATED DEVICE TECHNOLOGY INC
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|
Part Package Code
|
BGA
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|
Package Description
|
BGA, BGA240,18X18,40
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|
Pin Count
|
240
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|
Reach Compliance Code
|
not_compliant
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|
ECCN Code
|
EAR99
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|
HTS Code
|
8542.32.00.71
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|
Access Time-Max
|
3.6 ns
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Additional Feature
|
ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE
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Alternate Memory Width
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9
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Clock Frequency-Max (fCLK)
|
83 MHz
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Cycle Time
|
5 ns
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JESD-30 Code
|
S-PBGA-B240
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|
JESD-609 Code
|
e0
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Length
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19 mm
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Memory Density
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2359296 bit
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Memory IC Type
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OTHER FIFO
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Memory Width
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18
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Moisture Sensitivity Level
|
3
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Number of Functions
|
1
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Number of Terminals
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240
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Number of Words
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131072 words
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|
Number of Words Code
|
128000
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Operating Mode
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SYNCHRONOUS
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Operating Temperature-Max
|
85 °C
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Operating Temperature-Min
|
-40 °C
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Organization
|
128KX18
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Output Enable
|
YES
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Package Body Material
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PLASTIC/EPOXY
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Package Code
|
BGA
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Package Equivalence Code
|
BGA240,18X18,40
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Package Shape
|
SQUARE
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Package Style
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GRID ARRAY
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Parallel/Serial
|
PARALLEL
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|
Peak Reflow Temperature (Cel)
|
225
|
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Qualification Status
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Not Qualified
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Seated Height-Max
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1.97 mm
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Standby Current-Max
|
0.02 A
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Supply Current-Max
|
0.07 mA
|
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Supply Voltage-Max (Vsup)
|
2.625 V
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Supply Voltage-Min (Vsup)
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2.375 V
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Supply Voltage-Nom (Vsup)
|
2.5 V
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Surface Mount
|
YES
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Technology
|
CMOS
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Temperature Grade
|
INDUSTRIAL
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Terminal Finish
|
TIN LEAD
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Terminal Form
|
BALL
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Terminal Pitch
|
1 mm
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Terminal Position
|
BOTTOM
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Time@Peak Reflow Temperature-Max (s)
|
30
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Width
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19 mm
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Alternate Parts for IDT72T18105L5BBI
This table gives cross-reference parts and alternative options found for IDT72T18105L5BBI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IDT72T18105L5BBI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| 72T18105L5BBI | 128K x 18 / 256K x 9 TeraSync FIFO, 2.5V, PBGA84/Tray | Renesas Electronics Corporation | IDT72T18105L5BBI vs 72T18105L5BBI |
| IDT72T18105L5BB | FIFO, 128KX18, 3.6ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 | Integrated Device Technology Inc | IDT72T18105L5BBI vs IDT72T18105L5BB |
| 72T18105L5BBI | PBGA-240, Tray | Integrated Device Technology Inc | IDT72T18105L5BBI vs 72T18105L5BBI |
| 72T18105L5BBG | FIFO, 128KX18, 3.6ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 | Integrated Device Technology Inc | IDT72T18105L5BBI vs 72T18105L5BBG |
| IDT72T18105L5BBG | FIFO, 128KX18, 3.6ns, Synchronous, CMOS, PBGA240, 19 X 19 MM, 1 MM PITCH, PLASTIC, BGA-240 | Integrated Device Technology Inc | IDT72T18105L5BBI vs IDT72T18105L5BBG |