Part Details for IDT72T18105L4-4BBI by Integrated Device Technology Inc
Overview of IDT72T18105L4-4BBI by Integrated Device Technology Inc
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Applications
Computing and Data Storage
Part Details for IDT72T18105L4-4BBI
IDT72T18105L4-4BBI CAD Models
IDT72T18105L4-4BBI Part Data Attributes:
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IDT72T18105L4-4BBI
Integrated Device Technology Inc
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Datasheet
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IDT72T18105L4-4BBI
Integrated Device Technology Inc
FIFO, 128KX18, 8ns, Synchronous/Asynchronous, CMOS, PBGA240
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 8 ns | |
| Alternate Memory Width | 9 | |
| Clock Frequency-Max (fCLK) | 100 MHz | |
| JESD-30 Code | S-PBGA-B240 | |
| JESD-609 Code | e0 | |
| Memory Density | 2359296 bit | |
| Memory IC Type | OTHER FIFO | |
| Memory Width | 18 | |
| Moisture Sensitivity Level | 3 | |
| Number of Terminals | 240 | |
| Number of Words | 131072 words | |
| Number of Words Code | 128000 | |
| Operating Mode | SYNCHRONOUS/ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 128KX18 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA240,18X18,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Peak Reflow Temperature (Cel) | 225 | |
| Qualification Status | Not Qualified | |
| Standby Current-Max | 0.05 A | |
| Supply Current-Max | 0.06 mA | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 |