Part Details for IDT70824S35PF8 by Integrated Device Technology Inc
Overview of IDT70824S35PF8 by Integrated Device Technology Inc
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (8 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for IDT70824S35PF8
IDT70824S35PF8 CAD Models
IDT70824S35PF8 Part Data Attributes:
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IDT70824S35PF8
Integrated Device Technology Inc
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Datasheet
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IDT70824S35PF8
Integrated Device Technology Inc
Standard SRAM, 4KX16, 35ns, CMOS, PQFP80, TQFP-80
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEGRATED DEVICE TECHNOLOGY INC | |
| Part Package Code | QFP | |
| Package Description | TQFP-80 | |
| Pin Count | 80 | |
| Reach Compliance Code | not_compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 35 ns | |
| JESD-30 Code | S-PQFP-G80 | |
| JESD-609 Code | e0 | |
| Length | 14 mm | |
| Memory Density | 65536 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 16 | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 80 | |
| Number of Words | 4096 words | |
| Number of Words Code | 4000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 4KX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LQFP | |
| Package Equivalence Code | QFP80,.64SQ | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, LOW PROFILE | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 240 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.6 mm | |
| Standby Current-Max | 0.015 A | |
| Supply Current-Max | 0.34 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Finish | Tin/Lead (Sn85Pb15) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 20 | |
| Width | 14 mm |
Alternate Parts for IDT70824S35PF8
This table gives cross-reference parts and alternative options found for IDT70824S35PF8. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IDT70824S35PF8, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| IDT70824S35PFG | Standard SRAM, 4KX16, 35ns, CMOS, PQFP80, TQFP-80 | Integrated Device Technology Inc | IDT70824S35PF8 vs IDT70824S35PFG |
| 70824S35PFG | Standard SRAM, 4KX16, 35ns, CMOS, PQFP80, TQFP-80 | Integrated Device Technology Inc | IDT70824S35PF8 vs 70824S35PFG |
| 70824S35PF | TQFP-80, Tray | Integrated Device Technology Inc | IDT70824S35PF8 vs 70824S35PF |
| IDT70824S35PFB | Standard SRAM, 4KX16, 35ns, CMOS, PQFP80, TQFP-80 | Integrated Device Technology Inc | IDT70824S35PF8 vs IDT70824S35PFB |
| IDT70824S35PF9 | Standard SRAM, 4KX16, 35ns, CMOS, PQFP80, TQFP-80 | Integrated Device Technology Inc | IDT70824S35PF8 vs IDT70824S35PF9 |
| IDT70824S35PFBG | Standard SRAM, 4KX16, 35ns, CMOS, PQFP80, TQFP-80 | Integrated Device Technology Inc | IDT70824S35PF8 vs IDT70824S35PFBG |
| IDT70824S35PFG8 | Standard SRAM, 4KX16, 35ns, CMOS, PQFP80, TQFP-80 | Integrated Device Technology Inc | IDT70824S35PF8 vs IDT70824S35PFG8 |
| IDT70824S35PF | Standard SRAM, 4KX16, 35ns, CMOS, PQFP80, TQFP-80 | Integrated Device Technology Inc | IDT70824S35PF8 vs IDT70824S35PF |