Datasheets
IDT6116LA45P by: Integrated Device Technology Inc

Standard SRAM, 2KX8, 45ns, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24

Part Details for IDT6116LA45P by Integrated Device Technology Inc

Results Overview of IDT6116LA45P by Integrated Device Technology Inc

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Applications Computing and Data Storage Financial Technology (Fintech)

IDT6116LA45P Information

IDT6116LA45P by Integrated Device Technology Inc is an SRAM.
SRAMs are under the broader part category of Memory Components.

Memory components are essential in electronics for computer processing. They can be volatile or non-volatile, depending on the desired function. Read more about Memory Components on our Memory part category page.

Price & Stock for IDT6116LA45P

Part # Distributor Description Stock Price Buy
Quest Components 2K X 8 STANDARD SRAM, 45 NS, PDIP24 1
  • 1 $13.6500
$13.6500 Buy Now
Quest Components 2K X 8 STANDARD SRAM, 45 NS, PDIP24 1
  • 1 $25.7294
$25.7294 Buy Now
DISTI # SMC-IDT6116LA45P
Sensible Micro Corporation Ic 2Kx8 Sram 6116 RoHS: Not Compliant Min Qty: 25 Lead time: 0 Weeks, 1 Days Date Code: 2008+ Container: Tubes 1102
  • 100 $10.9980
  • 500 $10.7160
  • 1,000 $10.1520
$10.1520 / $10.9980 RFQ

Part Details for IDT6116LA45P

IDT6116LA45P CAD Models

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IDT6116LA45P Part Data Attributes

IDT6116LA45P Integrated Device Technology Inc
Buy Now Datasheet
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IDT6116LA45P Integrated Device Technology Inc Standard SRAM, 2KX8, 45ns, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24
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Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code DIP
Package Description 0.600 INCH, PLASTIC, DIP-24
Pin Count 24
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 45 ns
I/O Type COMMON
JESD-30 Code R-PDIP-T24
JESD-609 Code e0
Length 31.75 mm
Memory Density 16384 bit
Memory IC Type STANDARD SRAM
Memory Width 8
Number of Functions 1
Number of Ports 1
Number of Terminals 24
Number of Words 2048 words
Number of Words Code 2000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 2KX8
Output Characteristics 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP24,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 4.699 mm
Standby Current-Max 0.00002 A
Standby Voltage-Min 2 V
Supply Current-Max 0.075 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for IDT6116LA45P

This table gives cross-reference parts and alternative options found for IDT6116LA45P. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IDT6116LA45P, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
QP6116A-45DMB Teledyne e2v Check for Price SRAM IDT6116LA45P vs QP6116A-45DMB
IDT6116LA45PG Integrated Device Technology Inc Check for Price Standard SRAM, 2KX8, 45ns, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24 IDT6116LA45P vs IDT6116LA45PG
8403609JX Cypress Semiconductor Check for Price Standard SRAM, 2KX8, 45ns, CMOS, CDIP24, CERAMIC, DIP-24 IDT6116LA45P vs 8403609JX
6116LA45PGI Integrated Device Technology Inc Check for Price Standard SRAM, 2KX8, 45ns, CMOS, PDIP24, 0.600 INCH, ROHS COMPLIANT, PLASTIC, DIP-24 IDT6116LA45P vs 6116LA45PGI
8403609JX Pyramid Semiconductor Corporation Check for Price Standard SRAM, 2KX8, 45ns, CMOS, CDIP24, CERAMIC, DIP-24 IDT6116LA45P vs 8403609JX
8403609JA Renesas Electronics Corporation Check for Price 5.0V 2K x 8 Asynchronous Static RAM, CDIP15/Tube IDT6116LA45P vs 8403609JA
CY6116-45DMB Cypress Semiconductor Check for Price Standard SRAM, 2KX8, 45ns, CMOS, CDIP24, 0.600 INCH, CERDIP-24 IDT6116LA45P vs CY6116-45DMB
Part Number Manufacturer Composite Price Description Compare
8403609JA Cypress Semiconductor Check for Price Standard SRAM, 2KX8, 45ns, CMOS, CDIP24, 0.600 INCH, CERDIP-24 IDT6116LA45P vs 8403609JA
IDT6116SA45DGB Integrated Device Technology Inc Check for Price Standard SRAM, 2KX8, 45ns, CMOS, CDIP24, 0.600 INCH, CERAMIC, DIP-24 IDT6116LA45P vs IDT6116SA45DGB
6116SA45D Integrated Device Technology Inc Check for Price Standard SRAM, 2KX8, 45ns, CMOS, CDIP24, 0.600 INCH, CERAMIC, DIP-24 IDT6116LA45P vs 6116SA45D
IDT6116SA45PGI Integrated Device Technology Inc Check for Price Standard SRAM, 2KX8, 45ns, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24 IDT6116LA45P vs IDT6116SA45PGI
IDT6116LA45DB Renesas Electronics Corporation Check for Price Standard SRAM, 2KX8, 45ns, CMOS, CDIP24 IDT6116LA45P vs IDT6116LA45DB
IDT6116SA45PIG Integrated Device Technology Inc Check for Price Standard SRAM, 2KX8, 45ns, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24 IDT6116LA45P vs IDT6116SA45PIG
8403609JA Defense Logistics Agency Check for Price Standard SRAM, 2KX8, 45ns, CMOS, CDIP24, CERAMIC, DIP-24 IDT6116LA45P vs 8403609JA
IDT6116LA45PGI Integrated Device Technology Inc Check for Price Standard SRAM, 2KX8, 45ns, CMOS, PDIP24, 0.600 INCH, PLASTIC, DIP-24 IDT6116LA45P vs IDT6116LA45PGI
6116LA45PG Integrated Device Technology Inc Check for Price Standard SRAM, 2KX8, 45ns, CMOS, PDIP24, 0.600 INCH, ROHS COMPLIANT, PLASTIC, DIP-24 IDT6116LA45P vs 6116LA45PG
8403608JA Defense Logistics Agency Check for Price Standard SRAM, 2KX8, 45ns, CMOS, CDIP24, CERAMIC, DIP-24 IDT6116LA45P vs 8403608JA

IDT6116LA45P Related Parts

IDT6116LA45P Frequently Asked Questions (FAQ)

  • The recommended PCB layout for optimal performance of the IDT6116LA45P involves keeping the signal traces short and away from noise sources, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is also recommended.

  • To ensure reliable operation of the IDT6116LA45P in high-temperature environments, it is recommended to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device. Additionally, the device should be operated within its specified temperature range and derated accordingly.

  • Potential failure modes of the IDT6116LA45P include latch-up, electrostatic discharge (ESD), and thermal overload. These can be mitigated by following proper handling and storage procedures, using ESD protection devices, and ensuring that the device is operated within its specified voltage and current ratings.

  • Yes, the IDT6116LA45P is designed to be a low-power device, with a typical power consumption of 45mW. However, to further reduce power consumption, it is recommended to use the device's power-down mode, reduce the clock frequency, and optimize the system design to minimize power consumption.

  • To troubleshoot issues with the IDT6116LA45P, it is recommended to follow a systematic approach, including reviewing the system design and layout, checking the power supply and clock signals, and using debugging tools such as logic analyzers or oscilloscopes to capture and analyze the device's behavior.