There are no models available for this part yet.
Overview of ICM7522 by IC Microsystems Sdn Bhd
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 0 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Automotive
CAD Models for ICM7522 by IC Microsystems Sdn Bhd
Part Data Attributes for ICM7522 by IC Microsystems Sdn Bhd
|
|
|
|---|---|
|
Pbfree Code
|
No
|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Contact Manufacturer
|
|
Ihs Manufacturer
|
IC MICROSYSTEMS SDN BHD
|
|
Part Package Code
|
TSSOP
|
|
Package Description
|
TSSOP, TSSOP8,.19
|
|
Pin Count
|
8
|
|
Reach Compliance Code
|
unknown
|
|
HTS Code
|
8542.39.00.01
|
|
Converter Type
|
D/A CONVERTER
|
|
Input Bit Code
|
BINARY
|
|
JESD-30 Code
|
R-PDSO-G8
|
|
JESD-609 Code
|
e0
|
|
Linearity Error-Max (EL)
|
0.29%
|
|
Moisture Sensitivity Level
|
3
|
|
Number of Bits
|
8
|
|
Number of Functions
|
2
|
|
Number of Terminals
|
8
|
|
Operating Temperature-Max
|
85 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
TSSOP
|
|
Package Equivalence Code
|
TSSOP8,.19
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
|
Peak Reflow Temperature (Cel)
|
240
|
|
Qualification Status
|
Not Qualified
|
|
Supply Current-Max
|
0.19 mA
|
|
Surface Mount
|
YES
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Finish
|
TIN LEAD
|
|
Terminal Form
|
GULL WING
|
|
Terminal Pitch
|
0.635 mm
|
|
Terminal Position
|
DUAL
|