Part Details for ICM7322 by IC Microsystems Sdn Bhd
Overview of ICM7322 by IC Microsystems Sdn Bhd
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Transportation and Logistics
Healthcare
Telecommunications
Automotive
Part Details for ICM7322
ICM7322 CAD Models
ICM7322 Part Data Attributes:
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ICM7322
IC Microsystems Sdn Bhd
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Datasheet
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ICM7322
IC Microsystems Sdn Bhd
D/A Converter, 2 Func, PDSO10
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| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Contact Manufacturer | |
| Ihs Manufacturer | IC MICROSYSTEMS SDN BHD | |
| Part Package Code | TSSOP | |
| Package Description | TSSOP, TSSOP10,.19,20 | |
| Pin Count | 10 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| Converter Type | D/A CONVERTER | |
| Input Bit Code | BINARY | |
| JESD-30 Code | R-PDSO-G10 | |
| JESD-609 Code | e0 | |
| Linearity Error-Max (EL) | 0.29% | |
| Moisture Sensitivity Level | 3 | |
| Number of Bits | 8 | |
| Number of Functions | 2 | |
| Number of Terminals | 10 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | TSSOP | |
| Package Equivalence Code | TSSOP10,.19,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | |
| Peak Reflow Temperature (Cel) | 240 | |
| Qualification Status | Not Qualified | |
| Supply Current-Max | 2 mA | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL |