Part Details for IBM25PPC750L-DB0B350W by IBM
Overview of IBM25PPC750L-DB0B350W by IBM
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for IBM25PPC750L-DB0B350W
IBM25PPC750L-DB0B350W CAD Models
IBM25PPC750L-DB0B350W Part Data Attributes
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IBM25PPC750L-DB0B350W
IBM
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Datasheet
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IBM25PPC750L-DB0B350W
IBM
RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | IBM MICROELECTRONICS | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA360,19X19,50 | |
| Pin Count | 360 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 100 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-CBGA-B360 | |
| JESD-609 Code | e0 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Number of Terminals | 360 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | BGA | |
| Package Equivalence Code | BGA360,19X19,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.2 mm | |
| Speed | 350 MHz | |
| Supply Voltage-Max | 2.1 V | |
| Supply Voltage-Min | 2 V | |
| Supply Voltage-Nom | 2.05 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for IBM25PPC750L-DB0B350W
This table gives cross-reference parts and alternative options found for IBM25PPC750L-DB0B350W. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IBM25PPC750L-DB0B350W, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| IBM25PPC750L-DB0C350W | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 | IBM | IBM25PPC750L-DB0B350W vs IBM25PPC750L-DB0C350W |
| PC755MG350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | Atmel Corporation | IBM25PPC750L-DB0B350W vs PC755MG350LE |
| PC755BVZFU350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360 | Teledyne e2v | IBM25PPC750L-DB0B350W vs PC755BVZFU350LE |
| MPC755BPX350LE | 32-BIT, 350MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, PLASTIC, BGA-360 | Motorola Mobility LLC | IBM25PPC750L-DB0B350W vs MPC755BPX350LE |
| PC755VGHU350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 | Teledyne e2v | IBM25PPC750L-DB0B350W vs PC755VGHU350LE |
| PC755MGH350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 | Atmel Corporation | IBM25PPC750L-DB0B350W vs PC755MGH350LE |
| PCX755BMZFU350LE | RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-360 | Atmel Corporation | IBM25PPC750L-DB0B350W vs PCX755BMZFU350LE |
| IBM25PPC750L-EB0B350W | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 | IBM | IBM25PPC750L-DB0B350W vs IBM25PPC750L-EB0B350W |
| MPC755CVT350 | 32-BIT, 350MHz, RISC PROCESSOR, PBGA360 | NXP Semiconductors | IBM25PPC750L-DB0B350W vs MPC755CVT350 |
| IBM25PPC750L-DB0A350W | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 | IBM | IBM25PPC750L-DB0B350W vs IBM25PPC750L-DB0A350W |