Part Details for IBM25EMPPC750LEBF333 by IBM
Overview of IBM25EMPPC750LEBF333 by IBM
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Part Details for IBM25EMPPC750LEBF333
IBM25EMPPC750LEBF333 CAD Models
IBM25EMPPC750LEBF333 Part Data Attributes
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IBM25EMPPC750LEBF333
IBM
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IBM25EMPPC750LEBF333
IBM
RISC Microprocessor, 32-Bit, 333MHz, CMOS, CBGA360,
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Rohs Code | No | |
Part Life Cycle Code | Contact Manufacturer | |
Ihs Manufacturer | IBM MICROELECTRONICS | |
Package Description | BGA, BGA360,19X19,50 | |
Reach Compliance Code | unknown | |
ECCN Code | 3A991.A.2 | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | YES | |
Clock Frequency-Max | 100 MHz | |
External Data Bus Width | 64 | |
Format | FLOATING POINT | |
JESD-30 Code | S-XBGA-B360 | |
JESD-609 Code | e0 | |
Number of Terminals | 360 | |
Operating Temperature-Max | 105 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | CERAMIC | |
Package Code | BGA | |
Package Equivalence Code | BGA360,19X19,50 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Qualification Status | Not Qualified | |
Speed | 333 MHz | |
Supply Voltage-Max | 2.1 V | |
Supply Voltage-Min | 1.9 V | |
Supply Voltage-Nom | 2 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |