Part Details for IBM04188CXLBC-25 by IBM
Overview of IBM04188CXLBC-25 by IBM
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for IBM04188CXLBC-25
IBM04188CXLBC-25 CAD Models
IBM04188CXLBC-25 Part Data Attributes
|
|
IBM04188CXLBC-25
IBM
Buy Now
Datasheet
|
Compare Parts:
IBM04188CXLBC-25
IBM
Standard SRAM, 512KX18, 1.8ns, CMOS, PBGA153, BGA-153
|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | IBM MICROELECTRONICS | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA153,9X17,50 | |
| Pin Count | 153 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.B.2.A | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 1.8 ns | |
| Additional Feature | PIPELINED ARCHITECTURE | |
| Clock Frequency-Max (fCLK) | 400 MHz | |
| I/O Type | COMMON | |
| JESD-30 Code | R-PBGA-B153 | |
| JESD-609 Code | e0 | |
| Length | 22 mm | |
| Memory Density | 9437184 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 18 | |
| Number of Functions | 1 | |
| Number of Terminals | 153 | |
| Number of Words | 524288 words | |
| Number of Words Code | 512000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | ||
| Organization | 512KX18 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA153,9X17,50 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.679 mm | |
| Standby Current-Max | 0.15 A | |
| Standby Voltage-Min | 2.38 V | |
| Supply Current-Max | 0.54 mA | |
| Supply Voltage-Max (Vsup) | 2.625 V | |
| Supply Voltage-Min (Vsup) | 2.375 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 14 mm |
Alternate Parts for IBM04188CXLBC-25
This table gives cross-reference parts and alternative options found for IBM04188CXLBC-25. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IBM04188CXLBC-25, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| IBM0418A8CFLBB-3 | Standard SRAM, 512KX18, 1.8ns, CMOS, PBGA153, BGA-153 | IBM | IBM04188CXLBC-25 vs IBM0418A8CFLBB-3 |
| IBM0418A4CXLBB-5 | Standard SRAM, 512KX18, 2.5ns, CMOS, PBGA153, BGA-153 | IBM | IBM04188CXLBC-25 vs IBM0418A4CXLBB-5 |
| MCM64E918FC4.0R | 512KX18 DDR SRAM, 0.2ns, PBGA153, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-153 | Motorola Mobility LLC | IBM04188CXLBC-25 vs MCM64E918FC4.0R |
| MCM64E918FC5.0R | DDR SRAM, 512KX18, 0.2ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-153 | Motorola Semiconductor Products | IBM04188CXLBC-25 vs MCM64E918FC5.0R |
| K7D801871B-HC300 | DDR SRAM, 512KX18, 0.2ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153 | Samsung Semiconductor | IBM04188CXLBC-25 vs K7D801871B-HC300 |
| IBM04188CXLBC-30 | Standard SRAM, 512KX18, 1.7ns, CMOS, PBGA153, BGA-153 | IBM | IBM04188CXLBC-25 vs IBM04188CXLBC-30 |
| IBM0418A8CXLBB-4 | Standard SRAM, 512KX18, 2ns, CMOS, PBGA153, BGA-153 | IBM | IBM04188CXLBC-25 vs IBM0418A8CXLBB-4 |
| MCM64E918RS3.3R | DDR SRAM, 512KX18, 0.2ns, CMOS, CBGA153, 14 X 22 MM, 1.27 MM PITCH, CERAMIC, FLIP CHIP, BGA-153 | Motorola Semiconductor Products | IBM04188CXLBC-25 vs MCM64E918RS3.3R |
| CXK77R1882AGB-42 | DDR SRAM, 512KX18, 2.6ns, CMOS, PBGA153, 14 X 22 MM, 1.27 MM PITCH, BGA-153 | Sony Semiconductor | IBM04188CXLBC-25 vs CXK77R1882AGB-42 |
| MCM64E918FC5.0R | 512KX18 DDR SRAM, 0.2ns, PBGA153, 14 X 22 MM, 1.27 MM PITCH, PLASTIC, FLIP CHIP, BGA-153 | Motorola Mobility LLC | IBM04188CXLBC-25 vs MCM64E918FC5.0R |