Datasheets
I2716 by:

UVPROM, 2KX8, 450ns, MOS, CDIP24, CERDIP-24

Part Details for I2716 by Intel Corporation

Overview of I2716 by Intel Corporation

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Applications Industrial Automation Computing and Data Storage Financial Technology (Fintech) Telecommunications

Part Details for I2716

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I2716 Part Data Attributes

I2716 Intel Corporation
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I2716 Intel Corporation UVPROM, 2KX8, 450ns, MOS, CDIP24, CERDIP-24
Part Life Cycle Code Obsolete
Ihs Manufacturer INTEL CORP
Part Package Code DIP
Package Description WDIP,
Pin Count 24
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 450 ns
JESD-30 Code R-GDIP-T24
Length 32.07 mm
Memory Density 16384 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 24
Number of Words 2048 words
Number of Words Code 2000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 2KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.08 mm
Supply Current-Max 0.01 mA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology MOS
Temperature Grade INDUSTRIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 15.24 mm

Alternate Parts for I2716

This table gives cross-reference parts and alternative options found for I2716. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of I2716, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
M2716 UVPROM, 2KX8, 450ns, CMOS, PDIP24, DIP-24 Intel Corporation I2716 vs M2716
ET2716Q UVPROM, 2KX8, 450ns, NMOS, CDIP24, CERAMIC, DIP-24 Thales Group I2716 vs ET2716Q
AM2716-6DC UVPROM, 2KX8, 450ns, MOS, CDIP24, HERMETIC SEALED, WINDOWED, DIP-24 AMD I2716 vs AM2716-6DC
ET2716Q UVPROM, 2KX8, 450ns, NMOS, CDIP24, CERAMIC, DIP-24 Teledyne e2v I2716 vs ET2716Q
27C16Q450/883 2KX8 UVPROM, 450ns, CDIP24, WINDOWED, CERAMIC, DIP-24 Texas Instruments I2716 vs 27C16Q450/883
NMC27C16H-45 2KX8 UVPROM, 450ns, CDIP24, WINDOWED, CERDIP-24 Texas Instruments I2716 vs NMC27C16H-45
MD2716/B UVPROM, Rochester Electronics LLC I2716 vs MD2716/B
MD2716M/B UVPROM, 2KX8, 450ns, MOS, CDIP24, Intel Corporation I2716 vs MD2716M/B
MBM2716 UVPROM Card, 2KX8, 450ns, NMOS, CDIP24, CERAMIC, DIP-24 FUJITSU Semiconductor Limited I2716 vs MBM2716
M2716F6 UVPROM, 2KX8, 450ns, NMOS, CDIP24, CERAMIC, DIP-24 Thales Group I2716 vs M2716F6
Part Number Description Manufacturer Compare
27C16Q450/883 2KX8 UVPROM, 450ns, CDIP24, WINDOWED, CERAMIC, DIP-24 Texas Instruments I2716 vs 27C16Q450/883
NMC27C16H-45 2KX8 UVPROM, 450ns, CDIP24, WINDOWED, CERDIP-24 Texas Instruments I2716 vs NMC27C16H-45
ET2716Q UVPROM, 2KX8, 450ns, NMOS, CDIP24, CERAMIC, DIP-24 Teledyne e2v I2716 vs ET2716Q
AM2716B-450DC UVPROM, 2KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD I2716 vs AM2716B-450DC
ID2716 UVPROM, 2KX8, 450ns, MOS, CDIP24, CERDIP-24 Intel Corporation I2716 vs ID2716
M2716 UVPROM, 2KX8, 450ns, CMOS, PDIP24, DIP-24 Intel Corporation I2716 vs M2716
MD2716/B UVPROM, Rochester Electronics LLC I2716 vs MD2716/B
AM2716B-455DC UVPROM, 2KX8, 450ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 AMD I2716 vs AM2716B-455DC
7802201JA UVPROM, 2KX8, 450ns, NMOS, CDIP24, CERAMIC, DIP-24 Defense Logistics Agency I2716 vs 7802201JA
NMC27C16-45 2KX8 UVPROM, 450ns, CDIP24, WINDOWED, CERAMIC, DIP-24 Texas Instruments I2716 vs NMC27C16-45

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