Datasheets
HYB25D256163CE-4 by:

DDR DRAM, 16MX16, 0.6ns, CMOS, PDSO66, GREEN, PLASTIC, TSOP2-66

Part Details for HYB25D256163CE-4 by Infineon Technologies AG

Overview of HYB25D256163CE-4 by Infineon Technologies AG

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Part Details for HYB25D256163CE-4

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HYB25D256163CE-4 Part Data Attributes

HYB25D256163CE-4 Infineon Technologies AG
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HYB25D256163CE-4 Infineon Technologies AG DDR DRAM, 16MX16, 0.6ns, CMOS, PDSO66, GREEN, PLASTIC, TSOP2-66
Part Life Cycle Code Transferred
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Part Package Code TSOP2
Package Description TSOP2,
Pin Count 66
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.24
Access Mode FOUR BANK PAGE BURST
Access Time-Max 0.6 ns
Additional Feature AUTO/SELF REFRESH
JESD-30 Code R-PDSO-G66
Length 22.22 mm
Memory Density 268435456 bit
Memory IC Type DDR DRAM
Memory Width 16
Number of Functions 1
Number of Ports 1
Number of Terminals 66
Number of Words 16777216 words
Number of Words Code 16000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 16MX16
Package Body Material PLASTIC/EPOXY
Package Code TSOP2
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Self Refresh YES
Supply Voltage-Max (Vsup) 2.7 V
Supply Voltage-Min (Vsup) 2.5 V
Supply Voltage-Nom (Vsup) 2.6 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form GULL WING
Terminal Pitch 0.65 mm
Terminal Position DUAL
Width 10.16 mm

Alternate Parts for HYB25D256163CE-4

This table gives cross-reference parts and alternative options found for HYB25D256163CE-4. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HYB25D256163CE-4, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
HYB25DC256163CE-5 DDR DRAM, 16MX16, 0.6ns, CMOS, PDSO66, GREEN, PLASTIC, TSOP2-66 Qimonda AG HYB25D256163CE-4 vs HYB25DC256163CE-5
HYB25D256163CE-4.0 DDR DRAM, 16MX16, 0.6ns, CMOS, PDSO66, GREEN, PLASTIC, TSOP2-66 Infineon Technologies AG HYB25D256163CE-4 vs HYB25D256163CE-4.0
HYB25D256161CE-4 DDR DRAM, 16MX16, 0.6ns, CMOS, PDSO66, LEAD AND HALOGEN FREE, PLASTIC, TSOP2-66 Infineon Technologies AG HYB25D256163CE-4 vs HYB25D256161CE-4
Part Number Description Manufacturer Compare
V58C2256164SAE7 16MX16 DDR DRAM, 0.75ns, PDSO66, 0.400 X 0.875 INCH, ROHS COMPLIANT, PLASTIC, MS-024FC, TSOP2-66 ProMOS Technologies Inc HYB25D256163CE-4 vs V58C2256164SAE7
HM5425161BTT-10 DDR DRAM, 16MX16, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP2-66 Hitachi Ltd HYB25D256163CE-4 vs HM5425161BTT-10
V58C2256164SAI6 16MX16 DDR DRAM, 0.7ns, PDSO66, 0.400 X 0.875 INCH, GREEN, PLASTIC, MS-024FC, TSOP2-66 ProMOS Technologies Inc HYB25D256163CE-4 vs V58C2256164SAI6
V58C2256804SALE6 32MX8 DDR DRAM, 0.7ns, PDSO66, 0.400 X 0.875 INCH, ROHS COMPLIANT, PLASTIC, MS-024FC, TSOP2-66 ProMOS Technologies Inc HYB25D256163CE-4 vs V58C2256804SALE6
HYB25D256163CE-5 DDR DRAM, 16MX16, 0.65ns, CMOS, PDSO66, GREEN, PLASTIC, TSOP2-66 Infineon Technologies AG HYB25D256163CE-4 vs HYB25D256163CE-5
MB81N261647B-50FN Memory IC, FUJITSU Limited HYB25D256163CE-4 vs MB81N261647B-50FN
V58C2256804SAS5B 32MX8 DDR DRAM, 0.65ns, PBGA60, M0-233, FBGA-60 ProMOS Technologies Inc HYB25D256163CE-4 vs V58C2256804SAS5B
HYB25D256800CC-5 DDR DRAM, 32MX8, 0.5ns, CMOS, PBGA60, 8 X 12 MM, PLASTIC, TFBGA-60 Infineon Technologies AG HYB25D256163CE-4 vs HYB25D256800CC-5
V58C2256804SAF5 32MX8 DDR DRAM, 0.65ns, PBGA60, ROHS COMPLIANT, MO-233, FBGA-60 ProMOS Technologies Inc HYB25D256163CE-4 vs V58C2256804SAF5
V58C2256804SAS5 32MX8 DDR DRAM, 0.65ns, PBGA60, M0-233, FBGA-60 ProMOS Technologies Inc HYB25D256163CE-4 vs V58C2256804SAS5

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