Datasheets
HYB25D256160CC-6 by:

DDR DRAM, 16MX16, 0.7ns, CMOS, PBGA60, 8 X 12 MM, PLASTIC, TFBGA-60

Part Details for HYB25D256160CC-6 by Infineon Technologies AG

Overview of HYB25D256160CC-6 by Infineon Technologies AG

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Price & Stock for HYB25D256160CC-6

Part # Distributor Description Stock Price Buy
Quest Components DDR DRAM, 16MX16, 0.7NS, CMOS, PBGA60 800
  • 1 $15.0000
  • 109 $8.2500
  • 243 $7.5000
$7.5000 / $15.0000 Buy Now

Part Details for HYB25D256160CC-6

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HYB25D256160CC-6 Part Data Attributes:

HYB25D256160CC-6 Infineon Technologies AG
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HYB25D256160CC-6 Infineon Technologies AG DDR DRAM, 16MX16, 0.7ns, CMOS, PBGA60, 8 X 12 MM, PLASTIC, TFBGA-60
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Part Package Code BGA
Package Description 8 X 12 MM, PLASTIC, TFBGA-60
Pin Count 60
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.32.00.24
Access Mode FOUR BANK PAGE BURST
Access Time-Max 0.7 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 166 MHz
I/O Type COMMON
Interleaved Burst Length 2,4,8
JESD-30 Code R-PBGA-B60
JESD-609 Code e0
Length 12 mm
Memory Density 268435456 bit
Memory IC Type DDR1 DRAM
Memory Width 16
Number of Functions 1
Number of Ports 1
Number of Terminals 60
Number of Words 16777216 words
Number of Words Code 16000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 16MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TBGA
Package Equivalence Code BGA60,9X12,40/32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE
Qualification Status Not Qualified
Refresh Cycles 8192
Seated Height-Max 1.2 mm
Self Refresh YES
Sequential Burst Length 2,4,8
Standby Current-Max 0.005 A
Supply Current-Max 0.215 mA
Supply Voltage-Max (Vsup) 2.7 V
Supply Voltage-Min (Vsup) 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 8 mm

Alternate Parts for HYB25D256160CC-6

This table gives cross-reference parts and alternative options found for HYB25D256160CC-6. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HYB25D256160CC-6, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
HYB25DC256163CF-6 DDR DRAM, 16MX16, 0.7ns, CMOS, PBGA60, GREEN, PLASTIC, TFBGA-60 Qimonda AG HYB25D256160CC-6 vs HYB25DC256163CF-6
HYB25DC256160CF-6 DDR DRAM, 16MX16, 0.7ns, CMOS, PBGA60, 8 X 12 MM, GREEN, PLASTIC, TFBGA-60 Qimonda AG HYB25D256160CC-6 vs HYB25DC256160CF-6
HYB25D256160BF-6 DDR DRAM, 16MX16, 0.7ns, CMOS, PBGA60, 12 X 8 MM, PLASTIC, TFBGA-60 Infineon Technologies AG HYB25D256160CC-6 vs HYB25D256160BF-6
HYB25D256160CF-6 DDR DRAM, 16MX16, 0.7ns, CMOS, PBGA60, 8 X 12 MM, GREEN, PLASTIC, TFBGA-60 Qimonda AG HYB25D256160CC-6 vs HYB25D256160CF-6
HYB25DC256160CF-6 DDR DRAM, 16MX16, 0.7ns, CMOS, PBGA60, 8 X 12 MM, GREEN, PLASTIC, TFBGA-60 Infineon Technologies AG HYB25D256160CC-6 vs HYB25DC256160CF-6
Part Number Description Manufacturer Compare
HYB25D256160CF-5 DDR DRAM, 16MX16, 0.5ns, CMOS, PBGA60, 8 X 12 MM, GREEN, PLASTIC, TFBGA-60 Infineon Technologies AG HYB25D256160CC-6 vs HYB25D256160CF-5
HYB25DC256160CF-5 DDR DRAM, 16MX16, 0.5ns, CMOS, PBGA60, 8 X 12 MM, GREEN, PLASTIC, TFBGA-60 Infineon Technologies AG HYB25D256160CC-6 vs HYB25DC256160CF-5
HYB25D256160CC-5 DDR DRAM, 16MX16, 0.5ns, CMOS, PBGA66, 8 X 12 MM, PLASTIC, TFBGA-60 Infineon Technologies AG HYB25D256160CC-6 vs HYB25D256160CC-5
HYB25DC256160CF-6 DDR DRAM, 16MX16, 0.7ns, CMOS, PBGA60, 8 X 12 MM, GREEN, PLASTIC, TFBGA-60 Infineon Technologies AG HYB25D256160CC-6 vs HYB25DC256160CF-6

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