Datasheets
HYB18T512400AC-3.7 by:

DDR DRAM, 128MX4, 0.5ns, CMOS, PBGA60, PLASTIC, TFBGA-60

Part Details for HYB18T512400AC-3.7 by Infineon Technologies AG

Overview of HYB18T512400AC-3.7 by Infineon Technologies AG

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Applications Consumer Electronics Environmental Monitoring Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Electronic Manufacturing Entertainment and Gaming

Part Details for HYB18T512400AC-3.7

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HYB18T512400AC-3.7 Part Data Attributes

HYB18T512400AC-3.7 Infineon Technologies AG
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HYB18T512400AC-3.7 Infineon Technologies AG DDR DRAM, 128MX4, 0.5ns, CMOS, PBGA60, PLASTIC, TFBGA-60
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer INFINEON TECHNOLOGIES AG
Part Package Code BGA
Package Description PLASTIC, TFBGA-60
Pin Count 60
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.32.00.28
Access Mode FOUR BANK PAGE BURST
Access Time-Max 0.5 ns
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 267 MHz
I/O Type COMMON
Interleaved Burst Length 4,8
JESD-30 Code R-PBGA-B60
JESD-609 Code e0
Length 10.5 mm
Memory Density 536870912 bit
Memory IC Type DDR2 DRAM
Memory Width 4
Number of Functions 1
Number of Ports 1
Number of Terminals 60
Number of Words 134217728 words
Number of Words Code 128000000
Operating Mode SYNCHRONOUS
Operating Temperature-Max 95 °C
Operating Temperature-Min
Organization 128MX4
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TFBGA
Package Equivalence Code BGA60,9X11,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified
Refresh Cycles 8192
Seated Height-Max 1.2 mm
Self Refresh YES
Sequential Burst Length 4,8
Standby Current-Max 0.004 A
Supply Voltage-Max (Vsup) 1.9 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Width 10 mm

Alternate Parts for HYB18T512400AC-3.7

This table gives cross-reference parts and alternative options found for HYB18T512400AC-3.7. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HYB18T512400AC-3.7, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
V59C1512404QDLJ19A DDR DRAM, 128MX4, CMOS, PBGA60, GREEN, MO-207, FBGA-60 ProMOS Technologies Inc HYB18T512400AC-3.7 vs V59C1512404QDLJ19A
HY5PS12421CLFP-S5I DDR DRAM, 128MX4, 0.4ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60 SK Hynix Inc HYB18T512400AC-3.7 vs HY5PS12421CLFP-S5I
MT46V128M4BN-5BIT:F DDR DRAM, 128MX4, 0.7ns, CMOS, PBGA60, 10 X 12.50 MM, LEAD FREE, PLASTIC, FBGA-60 Micron Technology Inc HYB18T512400AC-3.7 vs MT46V128M4BN-5BIT:F
MT46V128M4FN-6TLIT:F DDR DRAM, 128MX4, 0.7ns, CMOS, PBGA60, 10 X 12.50 MM, PLASTIC, FBGA-60 Micron Technology Inc HYB18T512400AC-3.7 vs MT46V128M4FN-6TLIT:F
MT47H128M4JN-25E:F DDR DRAM, 128MX4, 0.4ns, CMOS, PBGA60, 8 X 10 MM, FBGA-60 Micron Technology Inc HYB18T512400AC-3.7 vs MT47H128M4JN-25E:F
HY5PS12421BLFP-S6 DDR DRAM, 128MX4, 0.4ns, CMOS, PBGA60, ROHS COMPLIANT, FBGA-60 SK Hynix Inc HYB18T512400AC-3.7 vs HY5PS12421BLFP-S6
V58C2512404SDUJ8I DDR DRAM, 128MX4, CMOS, PBGA60, GREEN, MO-207, FBGA-60 ProMOS Technologies Inc HYB18T512400AC-3.7 vs V58C2512404SDUJ8I
HY5PS12421LF-C4 DDR DRAM, 128MX4, 0.5ns, CMOS, PBGA60, FBGA-60 SK Hynix Inc HYB18T512400AC-3.7 vs HY5PS12421LF-C4
MT46V128M4FN-75:F DDR DRAM, 128MX4, 0.75ns, CMOS, PBGA60, 10 X 12.50 MM, PLASTIC, FBGA-60 Micron Technology Inc HYB18T512400AC-3.7 vs MT46V128M4FN-75:F
V58C2512404SBS75 DDR DRAM, 128MX4, 0.75ns, CMOS, PBGA60, MO-207, FBGA-60 ProMOS Technologies Inc HYB18T512400AC-3.7 vs V58C2512404SBS75

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