Part Details for HYB18T256800AC-3.7 by Infineon Technologies AG
Overview of HYB18T256800AC-3.7 by Infineon Technologies AG
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for HYB18T256800AC-3.7
HYB18T256800AC-3.7 CAD Models
HYB18T256800AC-3.7 Part Data Attributes
|
|
HYB18T256800AC-3.7
Infineon Technologies AG
Buy Now
Datasheet
|
Compare Parts:
HYB18T256800AC-3.7
Infineon Technologies AG
DDR DRAM, 32MX8, 0.5ns, CMOS, PBGA60, 10.50 X 10 MM, MO-207DJ-Z, FBGA-60
|
| Pbfree Code | No | |
| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Part Package Code | DSBGA | |
| Package Description | FBGA, | |
| Pin Count | 60 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.24 | |
| Access Mode | FOUR BANK PAGE BURST | |
| Access Time-Max | 0.5 ns | |
| Additional Feature | AUTO/SELF REFRESH | |
| JESD-30 Code | R-PBGA-B60 | |
| Length | 10.5 mm | |
| Memory Density | 268435456 bit | |
| Memory IC Type | DDR DRAM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 60 | |
| Number of Words | 33554432 words | |
| Number of Words Code | 32000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 95 °C | |
| Operating Temperature-Min | ||
| Organization | 32MX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Self Refresh | YES | |
| Supply Voltage-Max (Vsup) | 1.9 V | |
| Supply Voltage-Min (Vsup) | 1.7 V | |
| Supply Voltage-Nom (Vsup) | 1.8 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | OTHER | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 10 mm |
Alternate Parts for HYB18T256800AC-3.7
This table gives cross-reference parts and alternative options found for HYB18T256800AC-3.7. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of HYB18T256800AC-3.7, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| V58C2256804SALS6 | 32MX8 DDR DRAM, 0.7ns, PBGA60, M0-233, FBGA-60 | ProMOS Technologies Inc | HYB18T256800AC-3.7 vs V58C2256804SALS6 |
| V59C1256804QALJ-3 | 32MX8 DDR DRAM, 0.45ns, PBGA60, GREEN, MO-207, FBGA-60 | ProMOS Technologies Inc | HYB18T256800AC-3.7 vs V59C1256804QALJ-3 |
| MB81N261647B-55FN | Memory IC, | FUJITSU Limited | HYB18T256800AC-3.7 vs MB81N261647B-55FN |
| V58C2256164SAT6 | 16MX16 DDR DRAM, 0.7ns, PDSO66, 0.400 X 0.875 INCH, PLASTIC, MS-024FC, TSOP2-66 | ProMOS Technologies Inc | HYB18T256800AC-3.7 vs V58C2256164SAT6 |
| V58C2256164SAI5B | 16MX16 DDR DRAM, 0.65ns, PDSO66, 0.400 X 0.875 INCH, GREEN, PLASTIC, MS-024FC, TSOP2-66 | ProMOS Technologies Inc | HYB18T256800AC-3.7 vs V58C2256164SAI5B |
| V58C2256804SALT5B | 32MX8 DDR DRAM, 0.65ns, PDSO66, 0.400 X 0.875 INCH, PLASTIC, MS-024FC, TSOP2-66 | ProMOS Technologies Inc | HYB18T256800AC-3.7 vs V58C2256804SALT5B |
| HYB18T256800AF-25F | DDR DRAM, 32MX8, 0.4ns, CMOS, PBGA60, GREEN, PLASTIC, TFBGA-60 | Infineon Technologies AG | HYB18T256800AC-3.7 vs HYB18T256800AF-25F |
| V58C2256804SALS5B | 32MX8 DDR DRAM, 0.65ns, PBGA60, M0-233, FBGA-60 | ProMOS Technologies Inc | HYB18T256800AC-3.7 vs V58C2256804SALS5B |
| HYB25D256800CE-7 | DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, PLASTIC, TSOP2-66 | Infineon Technologies AG | HYB18T256800AC-3.7 vs HYB25D256800CE-7 |
| HYB25D256800CF-5 | DDR DRAM, 32MX8, 0.5ns, CMOS, PBGA60, 8 X 12 MM, GREEN, PLASTIC, TFBGA-60 | Infineon Technologies AG | HYB18T256800AC-3.7 vs HYB25D256800CF-5 |